Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710673 | Interposer and semiconductor package including the same | Choongbin Yim, Dongwook Kim, Hyunki Kim, Jongbo Shim, Jihwang Kim +2 more | 2023-07-25 |
| 9252031 | Semiconductor package and method of fabricating the same | Hohyeuk Im, Jongkook Kim, Gowoon Seong, Seokwon Lee, Eunseok Cho | 2016-02-02 |
| 9252095 | Semiconductor package and method of fabricating the same | Jongkook Kim, Su-Min Park, Soojeoung Park, Bona Baek, Hohyeuk Im +1 more | 2016-02-02 |
| 8785251 | Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die | SooMoon Park, DongSoo Moon | 2014-07-22 |
| 8569895 | Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die | SooMoon Park, DongSoo Moon | 2013-10-29 |
| 8193036 | Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die | SooMoon Park, DongSoo Moon | 2012-06-05 |