| 12424601 |
Semiconductor package and manufacturing method thereof |
Jinwoo Park |
2025-09-23 |
| 12388029 |
Semiconductor package |
Jihwang Kim, Jongbo Shim, Jinwoo Park |
2025-08-12 |
| 12148729 |
Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same |
Jihwang Kim, Jongbo Shim |
2024-11-19 |
| 12021036 |
Semiconductor package including interposer and method of manufacturing the semiconductor package |
Jongbo Shim, Jihwang Kim |
2024-06-25 |
| 11854989 |
Semiconductor package substrate and semiconductor package including the same |
Dongho Kim, Jongbo Shim, Hwan Pil Park, Jungwoo Kim |
2023-12-26 |
| 11798889 |
Methods of manufacturing semiconductor packages |
Jungwoo Kim, Jihwang Kim, Jongbo Shim, Kyoungsei Choi |
2023-10-24 |
| 11710673 |
Interposer and semiconductor package including the same |
Dongwook Kim, Hyunki Kim, Jongbo Shim, Jihwang Kim, Sungkyu Park +2 more |
2023-07-25 |
| 11581263 |
Semiconductor package, and package on package having the same |
Jungwoo Kim, Jihwang Kim, Jungsoo Byun, Jongbo Shim, Doohwan Lee +3 more |
2023-02-14 |
| 11521934 |
Semiconductor package including interposer and method of manufacturing the semiconductor package |
Jongbo Shim, Jihwang Kim |
2022-12-06 |
| 11367688 |
Semiconductor package with interposer |
Jungwoo Kim, Jihwang Kim, Jongbo Shim, Kyoungsei Choi |
2022-06-21 |
| 10770446 |
Semiconductor packages and methods of manufacturing the same |
Young Lyong Kim, Jin-Woo Park, Younji Min |
2020-09-08 |
| 10177131 |
Semiconductor packages and methods of manufacturing the same |
Young Lyong Kim, Jin-Woo Park, Younji Min |
2019-01-08 |
| 9245772 |
Stackable package by using internal stacking modules |
JoungIn Yang, KeonTeak Kang, YoungChul Kim |
2016-01-26 |
| 9245867 |
Package-on-package electronic devices including sealing layers and related methods of forming the same |
Hae-Jung Yu, Taesung Park |
2016-01-26 |
| 9035308 |
Semiconductor package and method of fabricating the same |
Hyeongmun Kang, Taesung Park, Eunchul Ahn |
2015-05-19 |
| 8779606 |
Package-on-package electronic devices including sealing layers and related methods of forming the same |
Hae-Jung Yu, Taesung Park |
2014-07-15 |
| 8569114 |
Method of forming a semiconductor device package |
Seungkon Mok, Donghan Kim, Jin-Woo Park, PaLan Lee, Mi-Yeon Kim |
2013-10-29 |
| 8338941 |
Semiconductor packages and methods of fabricating the same |
Jinho Lee, Jin-Woo Park, Dae-Young Choi, Mi-Yeon Kim |
2012-12-25 |
| 7800211 |
Stackable package by using internal stacking modules |
JoungIn Yang, KeonTeak Kang, YoungChul Kim |
2010-09-21 |
