Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388046 | Semiconductor package | Hongwon KIM, JunMo Koo, Yeonjoo Kim, Yunhee Kim, Jongkook Kim +1 more | 2025-08-12 |
| 12315822 | Methods of manufacturing a fan-out panel level semiconductor package | Jeongho Lee | 2025-05-27 |
| 12283446 | Switch and electronic device including the same | Dongil YANG, Taeyoung Kim, Hyoseok NA, Jonghyun Park | 2025-04-22 |
| 12243791 | Semiconductor package | Sunghawn Bae, Jooyoung Choi | 2025-03-04 |
| 12205939 | Semiconductor package | Seokhyun Lee, Jeongho Lee | 2025-01-21 |
| 12015014 | Semiconductor package | Jungsoo Byun | 2024-06-18 |
| 11962341 | Electronic device and method for wireless communication | Yousung LEE, Dongil YANG, Hyoseok NA | 2024-04-16 |
| 11942458 | Semiconductor package including a through-electrode penetrating a molding part | Wonkyoung Choi, Jeongho Lee | 2024-03-26 |
| 11901301 | Semiconductor package | Jeongho Lee | 2024-02-13 |
| 11811143 | Oam multiplexing communication system and inter-mode interference elimination method | Hirofumi Sasaki, Hiroyuki Fukumoto, Hiroyuki Shiba | 2023-11-07 |
| 11791230 | Fan-out semiconductor package | Joonsung Kim, Jinseon Park | 2023-10-17 |
| 11735532 | Semiconductor packages | Joonsung Kim, Taeho Ko, Bongsoo Kim, Seokbong Park | 2023-08-22 |
| 11721577 | Semiconductor package and method of manufacturing the same | Dowan KIM, Seunghwan Baek | 2023-08-08 |
| 11676915 | Semiconductor package | Taesung Jeong, Hongwon KIM, Junggon Choi | 2023-06-13 |
| 11581263 | Semiconductor package, and package on package having the same | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jungsoo Byun, Jongbo Shim +3 more | 2023-02-14 |
| 11444706 | Antenna module including communication module capable of determining abnormality of transmission or reception path | Dongil YANG, Seonjun KIM, Jonghyun Park, Jongin LEE | 2022-09-13 |
| 11411325 | OAM multiplexing communication system and OAM multiplexing communication method | Hirofumi Sasaki, Hiroyuki Fukumoto, Hiroyuki Shiba | 2022-08-09 |
| 11355445 | Semiconductor packages | Joonsung Kim, Taeho Ko, Bongsoo Kim, Seokbong Park | 2022-06-07 |
| 11342239 | Semiconductor package | Sunghawn Bae, Jooyoung Choi | 2022-05-24 |
| 11323165 | Wireless communication device and wireless communication method | Hirofumi Sasaki, Hiroyuki Fukumoto, Hiroyuki Shiba | 2022-05-03 |
| 11302572 | Semiconductor package and method of manufacturing the same | Dowan KIM, Seunghwan Baek | 2022-04-12 |
| 11289456 | Semiconductor package | Jungsoo Byun | 2022-03-29 |
| 11228363 | OAM multiplexing communication system and inter-mode interference elimination method | Hirofumi Sasaki, Hiroyuki Fukumoto, Hiroyuki Shiba | 2022-01-18 |
| 11201397 | Circuit and wireless device | Takana Kaho, Hirofumi Sasaki, Yasunori YAGI, Takashi Shimizu | 2021-12-14 |
| 11202211 | OAM multiplexing communication system and OAM multiplexing communication method | Hirofumi Sasaki, Hiroyuki Fukumoto, Hiroyuki Shiba | 2021-12-14 |