Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11985835 | Film structure, element, and multilevel element | Myungmo Sung, Hongbum Kim, Jinwon Jung | 2024-05-14 |
| 11791230 | Fan-out semiconductor package | Joonsung Kim, Doohwan Lee | 2023-10-17 |
| 11127646 | Fan-out semiconductor package | Joonsung Kim, Doohwan Lee | 2021-09-21 |
| 11088060 | Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package | Jaekul Lee, Junwoo Myung | 2021-08-10 |