| 12283577 |
Fan-out semiconductor package |
Seokwon Lee |
2025-04-22 |
| 12284066 |
Apparatus and method for effectively mapping reference signal for V2X communication in wireless communication system |
Yangsoo Kwon, Jinwoo Oh, Yongin Choi |
2025-04-22 |
| 12176262 |
Semiconductor package |
Eunseok Cho, Minjeong Gu, Jaehoon Choi |
2024-12-24 |
| 12159833 |
Fan-out semiconductor packages |
Khaile Kim |
2024-12-03 |
| 12062617 |
Semiconductor package |
— |
2024-08-13 |
| 11968648 |
Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication system |
Yongin Choi, Yangsoo Kwon, Jinwoo Oh |
2024-04-23 |
| 11854912 |
Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad |
Yonghwan Kwon, Sanguk Kim |
2023-12-26 |
| 11798862 |
Semiconductor package |
Eunseok Cho, Minjeong Gu, Jaehoon Choi |
2023-10-24 |
| 11791230 |
Fan-out semiconductor package |
Doohwan Lee, Jinseon Park |
2023-10-17 |
| 11735532 |
Semiconductor packages |
Doohwan Lee, Taeho Ko, Bongsoo Kim, Seokbong Park |
2023-08-22 |
| 11689262 |
Communication device for performing beamforming and operating method thereof |
Yongin Choi, Yangsoo Kwon, Jinwoo Oh, Mingoo Kim, Inhyoung Kim +2 more |
2023-06-27 |
| 11574868 |
Fan-out semiconductor packages |
Khaile Kim |
2023-02-07 |
| 11569957 |
Method and apparatus for transmitting and receiving downlink control channel in shortened transmission time intervals |
Yangsoo Kwon, Yongin Choi |
2023-01-31 |
| 11503569 |
Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication system |
Yongin Choi, Yangsoo Kwon, Jinwoo Oh |
2022-11-15 |
| 11452770 |
Recombinant vaccinia virus and use thereof |
Sujeong Kim, Minjung Kim, Heonsik Choi, Jaeil SHIN, Minju Kim +5 more |
2022-09-27 |
| 11355445 |
Semiconductor packages |
Doohwan Lee, Taeho Ko, Bongsoo Kim, Seokbong Park |
2022-06-07 |
| 11158581 |
Semiconductor package having semiconductor chip between first and second redistribution layers |
Doohwan Lee |
2021-10-26 |
| 11127646 |
Fan-out semiconductor package |
Doohwan Lee, Jinseon Park |
2021-09-21 |
