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USPTO Patent Rankings Data through Dec 31, 2025
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Joonsung Kim — 18 Patents

Samsung: 17 patents #8,050 of 75,807Top 15%
KSKolon Life Science: 1 patents #12 of 35Top 35%
Hwaseong-si, KR: #659 of 5,073 inventorsTop 15%
Overall (All Time): #245,716 of 4,157,543Top 6%
18 Patents All Time
Joonsung Kim has been granted 18 US patents while listed as an inventor at Samsung. The first was granted in 2021 and the most recent in April 2025. Joonsung Kim ranks #245,716 of 4,157,543 US inventors in our database (top 5.9%). Patent records list Joonsung Kim in Hwaseong-si, KR.

Patents per Year

Patents granted per year, 2021 to 2025Bar chart with a peak of 7 patents in 2023.peak 72021: 2 patents20212022: 3 patents20222023: 7 patents20232024: 4 patents20242025: 2 patents2025

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
12283577 Fan-out semiconductor package Seokwon Lee 2025-04-22
12284066 Apparatus and method for effectively mapping reference signal for V2X communication in wireless communication system Yangsoo Kwon, Jinwoo Oh, Yongin Choi 2025-04-22
12176262 Semiconductor package Eunseok Cho, Minjeong Gu, Jaehoon Choi 2024-12-24
12159833 Fan-out semiconductor packages Khaile Kim 2024-12-03
12062617 Semiconductor package — 2024-08-13
11968648 Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication system Yongin Choi, Yangsoo Kwon, Jinwoo Oh 2024-04-23
11854912 Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad Yonghwan Kwon, Sanguk Kim 2023-12-26
11798862 Semiconductor package Eunseok Cho, Minjeong Gu, Jaehoon Choi 2023-10-24
11791230 Fan-out semiconductor package Doohwan Lee, Jinseon Park 2023-10-17
11735532 Semiconductor packages Doohwan Lee, Taeho Ko, Bongsoo Kim, Seokbong Park 2023-08-22
11689262 Communication device for performing beamforming and operating method thereof Yongin Choi, Yangsoo Kwon, Jinwoo Oh, Mingoo Kim, Inhyoung Kim +2 more 2023-06-27
11574868 Fan-out semiconductor packages Khaile Kim 2023-02-07
11569957 Method and apparatus for transmitting and receiving downlink control channel in shortened transmission time intervals Yangsoo Kwon, Yongin Choi 2023-01-31
11503569 Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication system Yongin Choi, Yangsoo Kwon, Jinwoo Oh 2022-11-15
11452770 Recombinant vaccinia virus and use thereof Sujeong Kim, Minjung Kim, Heonsik Choi, Jaeil SHIN, Minju Kim +5 more 2022-09-27
11355445 Semiconductor packages Doohwan Lee, Taeho Ko, Bongsoo Kim, Seokbong Park 2022-06-07
11158581 Semiconductor package having semiconductor chip between first and second redistribution layers Doohwan Lee 2021-10-26
11127646 Fan-out semiconductor package Doohwan Lee, Jinseon Park 2021-09-21

Frequent Collaborators

Yangsoo Kwon5 shared
Doohwan Lee5 shared
Yongin Choi5 shared
Jinwoo Oh4 shared
Minjeong Gu2 shared
Eunseok Cho2 shared

Nearby-Ranked Inventors

Takuma Inami18
Daniel Mills18
Jeffrey J. Beaver18
Atilhan Manay18
Chung-Wen Lo18
Andrew KENNEDY18
Max Heimel18
Kevin Skadron18
John B. Halander18