Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283577 | Fan-out semiconductor package | Seokwon Lee | 2025-04-22 |
| 12284066 | Apparatus and method for effectively mapping reference signal for V2X communication in wireless communication system | Yangsoo Kwon, Jinwoo Oh, Yongin Choi | 2025-04-22 |
| 12176262 | Semiconductor package | Eunseok Cho, Minjeong Gu, Jaehoon Choi | 2024-12-24 |
| 12159833 | Fan-out semiconductor packages | Khaile Kim | 2024-12-03 |
| 12062617 | Semiconductor package | — | 2024-08-13 |
| 11968648 | Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication system | Yongin Choi, Yangsoo Kwon, Jinwoo Oh | 2024-04-23 |
| 11854912 | Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad | Yonghwan Kwon, Sanguk Kim | 2023-12-26 |
| 11798862 | Semiconductor package | Eunseok Cho, Minjeong Gu, Jaehoon Choi | 2023-10-24 |
| 11791230 | Fan-out semiconductor package | Doohwan Lee, Jinseon Park | 2023-10-17 |
| 11735532 | Semiconductor packages | Doohwan Lee, Taeho Ko, Bongsoo Kim, Seokbong Park | 2023-08-22 |
| 11689262 | Communication device for performing beamforming and operating method thereof | Yongin Choi, Yangsoo Kwon, Jinwoo Oh, Mingoo Kim, Inhyoung Kim +2 more | 2023-06-27 |
| 11574868 | Fan-out semiconductor packages | Khaile Kim | 2023-02-07 |
| 11569957 | Method and apparatus for transmitting and receiving downlink control channel in shortened transmission time intervals | Yangsoo Kwon, Yongin Choi | 2023-01-31 |
| 11503569 | Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication system | Yongin Choi, Yangsoo Kwon, Jinwoo Oh | 2022-11-15 |
| 11452770 | Recombinant vaccinia virus and use thereof | Sujeong Kim, Minjung Kim, Heonsik Choi, Jaeil SHIN, Minju Kim +5 more | 2022-09-27 |
| 11355445 | Semiconductor packages | Doohwan Lee, Taeho Ko, Bongsoo Kim, Seokbong Park | 2022-06-07 |
| 11158581 | Semiconductor package having semiconductor chip between first and second redistribution layers | Doohwan Lee | 2021-10-26 |
| 11127646 | Fan-out semiconductor package | Doohwan Lee, Jinseon Park | 2021-09-21 |