Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388029 | Semiconductor package | Choongbin Yim, Jongbo Shim, Jinwoo Park | 2025-08-12 |
| 12334454 | Semiconductor package including molding layer | Dongho Kim | 2025-06-17 |
| 12261157 | Semiconductor device having package on package structure and method of manufacturing the semiconductor device | Jeonghyun Lee, Jongbo Shim | 2025-03-25 |
| 12148729 | Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same | Choongbin Yim, Jongbo Shim | 2024-11-19 |
| 12021036 | Semiconductor package including interposer and method of manufacturing the semiconductor package | Jongbo Shim, Choongbin Yim | 2024-06-25 |
| 11817401 | Semiconductor package including molding layer | Dongho Kim | 2023-11-14 |
| 11804477 | Semiconductor device having package on package structure and method of manufacturing the semiconductor device | Jeonghyun Lee, Jongbo Shim | 2023-10-31 |
| 11798889 | Methods of manufacturing semiconductor packages | Choongbin Yim, Jungwoo Kim, Jongbo Shim, Kyoungsei Choi | 2023-10-24 |
| 11710673 | Interposer and semiconductor package including the same | Choongbin Yim, Dongwook Kim, Hyunki Kim, Jongbo Shim, Sungkyu Park +2 more | 2023-07-25 |
| 11676949 | Semiconductor packages having supporting members | Taeseok Choi, Jongbo Shim | 2023-06-13 |
| 11581263 | Semiconductor package, and package on package having the same | Choongbin Yim, Jungwoo Kim, Jungsoo Byun, Jongbo Shim, Doohwan Lee +3 more | 2023-02-14 |
| 11521934 | Semiconductor package including interposer and method of manufacturing the semiconductor package | Jongbo Shim, Choongbin Yim | 2022-12-06 |
| 11404382 | Semiconductor package including an embedded semiconductor device | Jeongmin Kang, Hyunkyu Kim, Jongbo Shim, Kyoungsei Choi | 2022-08-02 |
| 11367688 | Semiconductor package with interposer | Choongbin Yim, Jungwoo Kim, Jongbo Shim, Kyoungsei Choi | 2022-06-21 |