| 12388029 |
Semiconductor package |
Choongbin Yim, Jongbo Shim, Jinwoo Park |
2025-08-12 |
| 12334454 |
Semiconductor package including molding layer |
Dongho Kim |
2025-06-17 |
| 12261157 |
Semiconductor device having package on package structure and method of manufacturing the semiconductor device |
Jeonghyun Lee, Jongbo Shim |
2025-03-25 |
| 12148729 |
Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same |
Choongbin Yim, Jongbo Shim |
2024-11-19 |
| 12021036 |
Semiconductor package including interposer and method of manufacturing the semiconductor package |
Jongbo Shim, Choongbin Yim |
2024-06-25 |
| 11817401 |
Semiconductor package including molding layer |
Dongho Kim |
2023-11-14 |
| 11804477 |
Semiconductor device having package on package structure and method of manufacturing the semiconductor device |
Jeonghyun Lee, Jongbo Shim |
2023-10-31 |
| 11798889 |
Methods of manufacturing semiconductor packages |
Choongbin Yim, Jungwoo Kim, Jongbo Shim, Kyoungsei Choi |
2023-10-24 |
| 11710673 |
Interposer and semiconductor package including the same |
Choongbin Yim, Dongwook Kim, Hyunki Kim, Jongbo Shim, Sungkyu Park +2 more |
2023-07-25 |
| 11676949 |
Semiconductor packages having supporting members |
Taeseok Choi, Jongbo Shim |
2023-06-13 |
| 11581263 |
Semiconductor package, and package on package having the same |
Choongbin Yim, Jungwoo Kim, Jungsoo Byun, Jongbo Shim, Doohwan Lee +3 more |
2023-02-14 |
| 11521934 |
Semiconductor package including interposer and method of manufacturing the semiconductor package |
Jongbo Shim, Choongbin Yim |
2022-12-06 |
| 11404382 |
Semiconductor package including an embedded semiconductor device |
Jeongmin Kang, Hyunkyu Kim, Jongbo Shim, Kyoungsei Choi |
2022-08-02 |
| 11367688 |
Semiconductor package with interposer |
Choongbin Yim, Jungwoo Kim, Jongbo Shim, Kyoungsei Choi |
2022-06-21 |
