Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261092 | Semiconductor package and manufacturing method thereof | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Ban-Li Wu, Hsiu-Jen Lin +1 more | 2025-03-25 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Mao-Yen Chang, Po-Yuan Teng, Chen-Hua Yu +3 more | 2024-06-18 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Shu-Rong Chun, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2024-06-18 |
| 11984372 | Integrated circuit package and method | Lipu Kris Chuang, Hsin-Yu Pan | 2024-05-14 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +3 more | 2023-05-09 |
| 11508656 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2022-11-22 |
| 11508671 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Chih-Yu Wang | 2022-11-22 |
| 11450581 | Integrated circuit package and method | Lipu Kris Chuang, Hsin-Yu Pan | 2022-09-20 |
| 11049805 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2021-06-29 |
| 10985115 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Chih-Yu Wang | 2021-04-20 |
| 10797008 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Chih-Yu Wang | 2020-10-06 |
| 10734328 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Chih-Lin Wang | 2020-08-04 |
| 10510686 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Chih-Lin Wang | 2019-12-17 |
| 10461023 | Semiconductor packages and methods of forming the same | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2019-10-29 |