Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327729 | Semiconductor FinFET device and method | — | 2025-06-10 |
| 12100604 | Method and system for recognizing and addressing plasma discharge during semiconductor processes | — | 2024-09-24 |
| 12085518 | Systems and methods for wafer bond monitoring | Hsi-Cheng Hsu | 2024-09-10 |
| 12080609 | Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus | Hung-Jui Kuo, Hui-Jung Tsai | 2024-09-03 |
| 11894250 | Method and system for recognizing and addressing plasma discharge during semiconductor processes | — | 2024-02-06 |
| 11823936 | Alignment holder and testing apparatus | Hung-Jui Kuo, Hui-Jung Tsai | 2023-11-21 |
| 11815471 | Systems and methods for wafer bond monitoring | Hsi-Cheng Hsu | 2023-11-14 |
| 11688413 | Method and system for audio recognition of arcing during semiconductor process | — | 2023-06-27 |
| 11615965 | Semiconductor FinFET device and method | — | 2023-03-28 |
| 11565365 | System and method for monitoring chemical mechanical polishing | Tien-Wen Wang, In-Tsang Lin, Hsin-Hui Chou | 2023-01-31 |
| 11543363 | Systems and methods for wafer bond monitoring | Hsi-Cheng Hsu | 2023-01-03 |
| 11508671 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo | 2022-11-22 |
| 11407636 | Inter-poly connection for parasitic capacitor and die size improvement | Shyh-Wei Cheng, Hsi-Cheng Hsu, Ji-Hong Chiang, Jui-Chun Weng, Shiuan-Jeng Lin +2 more | 2022-08-09 |
| 11335579 | Method for manufacturing a semiconductor package and method for testing bonding strength of composite specimen | Hung-Jui Kuo, Hui-Jung Tsai | 2022-05-17 |
| 11145526 | Method of analyzing a manufacturing of a semiconductor structure | — | 2021-10-12 |
| 11100639 | Method for skin examination based on RBX color-space transformation | Po-Han Huang, Shu-Chen Chang, Chia-Chen Lu, Wen-Chien Tsai, Yun-Hsuan Ou Yang | 2021-08-24 |
| 10985115 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo | 2021-04-20 |
| 10872793 | System and method for monitoring operation conditions of semiconductor manufacturing apparatus | Tien-Wen Wang, Hsin-Hui Chou, In-Tsang Lin | 2020-12-22 |
| 10867827 | Alignment holder, testing apparatus and method for manufacturing a semiconductor package | Hung-Jui Kuo, Hui-Jung Tsai | 2020-12-15 |
| 10847429 | Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus | Hung-Jui Kuo, Hui-Jung Tsai | 2020-11-24 |
| 10797008 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo | 2020-10-06 |
| 10770302 | Semiconductor FinFET device and method | — | 2020-09-08 |
| 10532925 | Heater design for MEMS chamber pressure control | Shyh-Wei Cheng, Hsi-Cheng Hsu, Hsin-Yu Chen, Ji-Hong Chiang, Jui-Chun Weng +1 more | 2020-01-14 |
| 10155656 | Inter-poly connection for parasitic capacitor and die size improvement | Shyh-Wei Cheng, Hsi-Cheng Hsu, Ji-Hong Chiang, Jui-Chun Weng, Shiuan-Jeng Lin +2 more | 2018-12-18 |
| 10131536 | Heater design for MEMS chamber pressure control | Shyh-Wei Cheng, Hsi-Cheng Hsu, Hsin-Yu Chen, Ji-Hong Chiang, Jui-Chun Weng +1 more | 2018-11-20 |