Issued Patents All Time
Showing 1–25 of 420 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431446 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2025-09-30 |
| 12418005 | Semiconductor package and manufacturing method thereof | Tzuan-Horng Liu, Kris Lipu Chuang, Hsin-Yu Pan | 2025-09-16 |
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Chuei-Tang Wang +1 more | 2025-09-09 |
| 12412817 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Chung-Shi Liu +1 more | 2025-09-09 |
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh +8 more | 2025-09-02 |
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo Lung Pan, Ching-Hua Hsieh +4 more | 2025-09-02 |
| 12394242 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2025-08-19 |
| 12388060 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Ting Hao Kuo, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2025-08-12 |
| 12381163 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai +3 more | 2025-08-05 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Po-Yuan Teng, Yu-Chia Lai +7 more | 2025-07-29 |
| 12374627 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2025-07-29 |
| 12368141 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Chung-Shi Liu, Chen-Hua Yu | 2025-07-22 |
| 12362274 | Package structure and method of forming the same | Chih-Hsuan Tai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-07-15 |
| 12362270 | Package structure and method of fabricating the same | Kris Lipu Chuang, Tzu-Sung Huang, Chih-Wei Lin, Yu-Fu Chen, Hsin-Yu Pan | 2025-07-15 |
| 12360321 | Package structure, semiconductor device and method of fabricating the same | Chung-Ming Weng, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Yu-Hao Chen | 2025-07-15 |
| 12362329 | Method of fabricating semiconductor package | Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-07-15 |
| 12362283 | Semiconductor device and method of manufacturing the same | Ming Hung Tseng, Cheng-Chieh Hsieh | 2025-07-15 |
| 12334434 | Package structure and method of forming the same | Chih-Hsuan Tai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-06-17 |
| 12322706 | Chip package and method of forming the same | Kuo Lung Pan, Tin-Hao Kuo | 2025-06-03 |
| 12322696 | Dual-mode wireless charging device | Shih-Wei Liang, Hung-Yi Kuo, Ming Hung Tseng, Hsien-Ming Tu | 2025-06-03 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai +2 more | 2025-05-13 |
| 12300618 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Tin-Hao Kuo, Yu-Chia Lai, Shih-Wei Chen | 2025-05-13 |
| 12300563 | Semiconductor package and method of fabricating the same | Tzuan-Horng Liu | 2025-05-13 |
| 12288729 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2025-04-29 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Mao-Yen Chang, Chih-Wei Lin, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2025-04-15 |