Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392803 | Probe card, method for designing probe card, method for producing tested semiconductor device method for testing unpackaged semiconductor by probe card, device under test and probe system | Yang-Hung Cheng, Jhin-Ying Lyu, Hao Wei | 2025-08-19 |
| 12368148 | Info packages including thermal dissipation blocks | Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee | 2025-07-22 |
| 12360321 | Package structure, semiconductor device and method of fabricating the same | Chung-Ming Weng, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu | 2025-07-15 |
| 12300684 | Semiconductor packages | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2025-05-13 |
| 12271029 | Directionally tunable optical reflector | Hui Yu Lee, Jui-Feng Kuan, Chien-Te Wu | 2025-04-08 |
| 12218082 | Package structure | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2025-02-04 |
| 12197123 | Methods for making semiconductor-based integrated circuits | Hui Yu Lee, Jui-Feng Kuan, Chien-Te Wu | 2025-01-14 |
| 12181722 | Structures and process flow for integrated photonic-electric ic package by using polymer waveguide | Hui Yu Lee, Chung-Ming Weng, Jui-Feng Kuan, Chien-Te Wu | 2024-12-31 |
| 12159791 | Info packages including thermal dissipation blocks | Ching-Yi Lin, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Shuo-Mao Chen | 2024-12-03 |
| 12127680 | Air cell device and air mattress system thereof | CHIH-KUANG CHANG, Sheng-Wei Lin, Chin-Chang Lin, Yue-Yin CHAO | 2024-10-29 |
| 12120941 | Method for preparing high-resolution quantum dot (QD) pixelated light-emitting film | Chengzhao Luo, Zhenwei Ren | 2024-10-15 |
| 12085769 | Integrated circuit device and method | Hui Yu Lee | 2024-09-10 |
| 12074148 | Heat dissipation in semiconductor packages and methods of forming same | Fong-Yuan Chang, Po-Hsiang Huang, Lee-Chung Lu, Jyh Chwen Frank Lee, Yii-Chian Lu +1 more | 2024-08-27 |
| 12055800 | Semiconductor structure | Hui Yu Lee, Jui-Feng Kuan, Chien-Te Wu | 2024-08-06 |
| 12029123 | Semiconductor structure and method of manufacturing a semiconductor structure | Hui Yu Lee, Jui-Feng Kuan | 2024-07-02 |
| 12011996 | Pedal adjustment system and seat adjustment system, and apparatus using same | Tzu Yu Kan | 2024-06-18 |
| 11994713 | Directionally tunable optical reflector | Hui Yu Lee, Jui-Feng Kuan, Chien-Te Wu | 2024-05-28 |
| 11967591 | Info packages including thermal dissipation blocks | Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee | 2024-04-23 |
| 11852967 | Methods for making semiconductor-based integrated circuits | Hui Yu Lee, Jui-Feng Kuan, Chien-Te Wu | 2023-12-26 |
| 11855006 | Memory device, package structure and fabricating method thereof | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2023-12-26 |
| 11817324 | Info packages including thermal dissipation blocks | Ching-Yi Lin, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Shuo-Mao Chen | 2023-11-14 |
| 11774468 | Vertical probe head | Chin-Tien Yang, Yang-Hung Cheng, Chin-Yi Tsai, Hui-Pin Yang, Horng-Chuan Sun | 2023-10-03 |
| 11754794 | Semiconductor device including optical through via and method of making | Chung-Ming Weng, Tsung-Yuan Yu, Hui Yu Lee, Hung-Yi Kuo, Jui-Feng Kuan +1 more | 2023-09-12 |
| 11740415 | Structures and process flow for integrated photonic-electric IC package by using polymer waveguide | Hui Yu Lee, Chung-Ming Weng, Jui-Feng Kuan, Chien-Te Wu | 2023-08-29 |
| 11688725 | Semiconductor packages | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2023-06-27 |