Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334424 | Package structure and manufacturing method thereof | Wei-Jhan Tsai, Sheng-Feng Weng, Ching-Yao Lin, Ming-Yu Yen, Kai-Fung Chang +2 more | 2025-06-17 |
| 12218082 | Package structure | Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng +4 more | 2025-02-04 |
| 11855006 | Memory device, package structure and fabricating method thereof | Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng +4 more | 2023-12-26 |
| 11031376 | Chip package and method of forming the same | Hsaing-Pin Kuan, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin, Chun-Yen Lan | 2021-06-08 |