Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417969 | Semiconductor structure and circuit structure | Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Yu-Min Liang, Jiun Yi Wu | 2025-09-16 |
| 12358194 | Molded semiconductor device and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu +1 more | 2025-07-15 |
| 12354997 | Package structure and manufacturing method thereof | Sheng-Hsiang Chiu, Tzu-Ting Chou, Sheng-Feng Weng, Chao-Wei Li, Chih-Wei Lin +1 more | 2025-07-08 |
| 12230549 | Three-dimensional integrated circuit structures and methods of forming the same | Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Sheng-Feng Weng, Yao-Tong Lai | 2025-02-18 |
| 12218082 | Package structure | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Yi-Da Tsai, Sheng-Feng Weng +4 more | 2025-02-04 |
| 12011859 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu +1 more | 2024-06-18 |
| 11861283 | Placement method and non-transitory computer readable storage medium | Chen-Fa Tsai, Che-Li Lin, Chung-Wei Huang, Liang-Chi Zane | 2024-01-02 |
| 11855006 | Memory device, package structure and fabricating method thereof | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Yi-Da Tsai, Sheng-Feng Weng +4 more | 2023-12-26 |
| 11810847 | Package structure and method of fabricating the same | Chin-Liang Chen, Kuan-Lin Ho, Pei-Rong Ni, Yu-Min Liang, Jiun Yi Wu | 2023-11-07 |
| 11731327 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu +1 more | 2023-08-22 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Yu-Min Liang, Jiun Yi Wu | 2023-02-28 |
| 11446851 | Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu +1 more | 2022-09-20 |
| 11309226 | Three-dimensional integrated circuit structures and methods of forming the same | Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Sheng-Feng Weng, Yao-Tong Lai | 2022-04-19 |
| 11075131 | Semiconductor package and method of forming the same | Yi-Da Tsai, Ching-Hua Hsieh, Chih-Wei Lin, Tsai-Tsung Tsai, Sheng-Chieh Yang | 2021-07-27 |
| 10816422 | Pressure sensor | Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang +1 more | 2020-10-27 |
| 10769341 | Method of placing macro cells and a simulated-evolution-based macro refinement method | You-Lun Deng | 2020-09-08 |
| 10372861 | Method of macro placement and a non-transitory computer readable medium thereof | Te-Wei Peng, Fa-Ta Chen, Chia-Ching Huang | 2019-08-06 |
| 10254185 | Pressure sensor | Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel +3 more | 2019-04-09 |
| 9958349 | Pressure sensor | Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel +3 more | 2018-05-01 |
| 9581512 | Pressure sensor with deformable membrane and method of manufacture | Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang +1 more | 2017-02-28 |
| 9448122 | Multi-point temperature sensing method for integrated circuit chip and system of the same | Soon-Jyh Chang, Guan-Ying Huang, Kuen-Jong Lee, Wen-Yu Su, Chung-Ho Chen +3 more | 2016-09-20 |
| 8966428 | Fixed-outline floorplanning approach for mixed-size modules | KAI-CHUNG CHAN | 2015-02-24 |