Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358194 | Molded semiconductor device and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu +1 more | 2025-07-15 |
| 12230549 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Sheng-Feng Weng | 2025-02-18 |
| 12011859 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu +1 more | 2024-06-18 |
| 11731327 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu +1 more | 2023-08-22 |
| 11446851 | Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu +1 more | 2022-09-20 |
| 11309226 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Sheng-Feng Weng | 2022-04-19 |
| 10283377 | Integrated fan-out package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu | 2019-05-07 |