Issued Patents All Time
Showing 1–25 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431446 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2025-09-30 |
| 12417927 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu +3 more | 2025-09-16 |
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo Lung Pan, Hao-Yi Tsai +4 more | 2025-09-02 |
| 12391033 | Lamination process, and manufacturing method of semiconductor package using a chuck | Wei Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo +1 more | 2025-08-19 |
| 12388060 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Ting Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin +1 more | 2025-08-12 |
| 12374595 | Package system and manufacturing method thereof | Pei-Hsuan Lee, Chien Ling Hwang | 2025-07-29 |
| 12368086 | Package structure having thermoelectric cooler | Chao-Wei Chiu, Chao-Wei Li, Hsiu-Jen Lin | 2025-07-22 |
| 12368149 | Methods of forming semiconductor packages | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2025-07-22 |
| 12368053 | Method for laser drilling process for an integrated circuit package | Chia-Shen Cheng, Chia-Lun Chang, Hao-Jan Pei, Hsiu-Jen Lin | 2025-07-22 |
| 12358194 | Molded semiconductor device and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2025-07-15 |
| 12354929 | Package structure and manufacturing method thereof | Kai-Fung Chang, Sheng-Feng Weng, Ming-Yu Yen, Wei-Jhan Tsai, Chao-Wei Chiu +2 more | 2025-07-08 |
| 12354997 | Package structure and manufacturing method thereof | Sheng-Hsiang Chiu, Chia-Min Lin, Tzu-Ting Chou, Sheng-Feng Weng, Chao-Wei Li +1 more | 2025-07-08 |
| 12334424 | Package structure and manufacturing method thereof | Kai-Ming Chiang, Wei-Jhan Tsai, Sheng-Feng Weng, Ching-Yao Lin, Ming-Yu Yen +2 more | 2025-06-17 |
| 12322640 | Semiconductor package and manufacturing method thereof | Sheng-Chieh Yang, Shing-Chao Chen, Chih-Wei Lin | 2025-06-03 |
| 12300684 | Semiconductor packages | Sheng-Chieh Yang, Chih-Wei Lin, Yu-Hao Chen | 2025-05-13 |
| 12300659 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Chih-Wei Lin, Chung-Shi Liu, Chen-Hua Yu | 2025-05-13 |
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen +2 more | 2025-04-01 |
| 12266673 | Semiconductor package and method of forming the same | Chia-Lun Chang, Chung-Hao Tsai, Chung-Shi Liu, Chuei-Tang Wang, Hsiu-Jen Lin | 2025-04-01 |
| 12261088 | Package structure and method of forming the same | Jen-Jui Yu, Hao-Jan Pei, Cheng-Ting Chen, Chih-Chiang Tsao, Hsiu-Jen Lin | 2025-03-25 |
| 12230597 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2025-02-18 |
| 12230549 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Chih-Wei Lin, Sheng-Hsiang Chiu, Sheng-Feng Weng, Yao-Tong Lai | 2025-02-18 |
| 12218082 | Package structure | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2025-02-04 |
| 12176299 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin +2 more | 2024-12-24 |
| 12176279 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Jen-Chun Liao, Pei-Hsuan Lee, Chia-Hung Liu | 2024-12-24 |
| 12176319 | Reflow method and system | Cheng-Shiuan Wong, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2024-12-24 |