Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12391033 | Lamination process, and manufacturing method of semiconductor package using a chuck | Wei Huang, Yu-Ching Lo, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei +1 more | 2025-08-19 |
| 12020997 | Methods of forming semiconductor device packages having alignment marks on a carrier substrate | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu | 2024-06-25 |
| 11993066 | Chuck, lamination process, and manufacturing method of semiconductor package using the same | Wei Huang, Yu-Ching Lo, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei +1 more | 2024-05-28 |
| 11916031 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2024-02-27 |
| 11721598 | Method of forming semiconductor device package having testing pads on an upper die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu | 2023-08-08 |
| 11335656 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2022-05-17 |
| 11309223 | Method of forming semiconductor device package having dummy devices on a first die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu | 2022-04-19 |
| 10784219 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2020-09-22 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu | 2020-06-02 |
| 10347607 | Semiconductor devices and methods of manufacture thereof | Chen-Hua Yu, Ming-Fa Chen | 2019-07-09 |
| 10147704 | Semiconductor devices and methods of manufacturing thereof | Chen-Hua Yu, Ming-Fa Chen | 2018-12-04 |
| 9899355 | Three-dimensional integrated circuit structure | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh | 2018-02-20 |
| 9875982 | Semiconductor device and manufacturing method thereof | Ming-Fa Chen, Chen-Hua Yu, Sung-Feng Yeh | 2018-01-23 |
| 8552743 | Microwave diffraction system | Tsun-Hsu Chang | 2013-10-08 |