Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362261 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2025-07-15 |
| 12223252 | Through-silicon via in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2025-02-11 |
| 12223250 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Meng-Wei Chiang | 2025-02-11 |
| 12218093 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2025-02-04 |
| 12165971 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2024-12-10 |
| 12124078 | Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same | Kuan-Yu Huang, Yu-Yun Huang, Tien-Yu Huang, Sung-Hui Huang, Shang-Yun Hou | 2024-10-22 |
| 12113036 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu | 2024-10-08 |
| 12080629 | Manufacturing method of semiconductor structure | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2024-09-03 |
| 12074131 | Package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh | 2024-08-27 |
| 11923302 | Semiconductor device and method of manufacture | Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Ming-Fa Chen, Chin-Chou Liu +1 more | 2024-03-05 |
| 11916031 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Ming-Fa Chen | 2024-02-27 |
| 11855029 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2023-12-26 |
| 11791243 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2023-10-17 |
| 11769724 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-09-26 |
| 11756901 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Ming-Fa Chen, Hsien-Wei Chen | 2023-09-12 |
| 11748544 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Meng-Wei Chiang | 2023-09-05 |
| 11735536 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu | 2023-08-22 |
| 11728247 | Manufacturing method of semiconductor structure | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2023-08-15 |
| 11586797 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2023-02-21 |
| 11482499 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Ming-Fa Chen, Hsien-Wei Chen | 2022-10-25 |
| 11462458 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2022-10-04 |
| 11410929 | Semiconductor device and method of manufacture | Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Ming-Fa Chen, Chin-Chou Liu +1 more | 2022-08-09 |
| 11387205 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2022-07-12 |
| 11342297 | Package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh | 2022-05-24 |
| 11335656 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Ming-Fa Chen | 2022-05-17 |