Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309243 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2022-04-19 |
| 11107779 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu | 2021-08-31 |
| 11094613 | Semiconductor structure and manufacturing method thereof | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2021-08-17 |
| 11080455 | Layout design of integrated circuit with through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Meng-Wei Chiang | 2021-08-03 |
| 10949597 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2021-03-16 |
| 10930580 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2021-02-23 |
| 10784219 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Ming-Fa Chen | 2020-09-22 |
| 10741506 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Ming-Fa Chen, Hsien-Wei Chen | 2020-08-11 |
| 10515874 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2019-12-24 |
| 10510701 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2019-12-17 |
| 10504776 | Methods for forming through-substrate vias penetrating inter-layer dielectric | Ming-Fa Chen, Yu-Young Wang | 2019-12-10 |
| 10312201 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Ming-Fa Chen, Hsien-Wei Chen | 2019-06-04 |
| 10049965 | Through-substrate vias and methods for forming the same | Ming-Fa Chen, Yu-Young Wang | 2018-08-14 |
| 9520340 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2016-12-13 |
| 9355935 | Connecting through vias to devices | Ming-Fa Chen, Yu-Young Wang | 2016-05-31 |
| 9153540 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2015-10-06 |
| 9123702 | Connecting through vias to devices | Ming-Fa Chen, Yu-Young Wang | 2015-09-01 |
| 8803292 | Through-substrate vias and methods for forming the same | Ming-Fa Chen, Yu-Young Wang | 2014-08-12 |
| 8624324 | Connecting through vias to devices | Ming-Fa Chen, Yu-Young Wang | 2014-01-07 |
| 8518796 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2013-08-27 |