Issued Patents All Time
Showing 1–25 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412882 | Buffer design for package integration | Jie Chen, Ming-Fa Chen, Chen-Hua Yu | 2025-09-09 |
| 12412860 | Package structure | Ming-Fa Chen | 2025-09-09 |
| 12406965 | Package | Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-09-02 |
| 12400999 | Semiconductor devices and methods of manufacture | Shin-Puu Jeng | 2025-08-26 |
| 12394772 | Molded dies in semiconductor packages and methods of forming same | Jie Chen, Ming-Fa Chen | 2025-08-19 |
| 12394758 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2025-08-19 |
| 12387945 | Semiconductor structures including glass core layer and methods of forming the same | Jing-Ye Juang, Shin-Puu Jeng | 2025-08-12 |
| 12368115 | Supporting InFO packages to reduce warpage | Jie Chen, Ying-Ju Chen | 2025-07-22 |
| 12368109 | Interposer structure for semiconductor package including peripheral metal pad around alignment mark and methods of fabricating same | Meng-Liang Lin, Shin-Puu Jeng | 2025-07-22 |
| 12368147 | Semiconductor structure having photonic die and electronic die | Ming-Fa Chen | 2025-07-22 |
| 12362261 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Ming-Fa Chen | 2025-07-15 |
| 12362178 | Method for fabricating a chip package | Jie Chen, Tzuan-Horng Liu, Ying-Ju Chen | 2025-07-15 |
| 12362342 | Semiconductor package | Jie Chen, Ming-Fa Chen | 2025-07-15 |
| 12362326 | Semiconductor package and method of manufacturing semiconductor package | Ming-Fa Chen | 2025-07-15 |
| 12362282 | Semiconductor structure and manufacturing method thereof | Ching-Jung Yang, Ming-Fa Chen | 2025-07-15 |
| 12355007 | Package and method of fabricating the same | Ming-Fa Chen | 2025-07-08 |
| 12354938 | Semiconductor package and methods of manufacturing | Meng-Liang Lin, Shin-Puu Jeng | 2025-07-08 |
| 12353008 | Package, optical device, and manufacturing method of package | Ming-Fa Chen | 2025-07-08 |
| 12347758 | Dual-underfill encapsulation for packaging and methods of forming the same | Jing-Ye Juang, Chia-Kuei Hsu, Ming-Chih Yew, Shin-Puu Jeng | 2025-07-01 |
| 12334459 | Integrated circuits | Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2025-06-17 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2025-06-10 |
| 12322728 | Method of manufacturing die stack structure | Ching-Jung Yang | 2025-06-03 |
| 12317655 | Semiconductor package and manufacturing method of semiconductor package | Ming-Fa Chen, Jie Chen | 2025-05-27 |
| 12315842 | Package structure | Ming-Fa Chen, Sung-Feng Yeh | 2025-05-27 |
| 12308321 | Structures to increase substrate routing density and methods of forming the same | Meng-Liang Lin, Shin-Puu Jeng | 2025-05-20 |