Issued Patents All Time
Showing 1–25 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12420891 | Release device for polar profile observation system | Hangzhou Wang, Yijie Wen, Jiajun Li, Junhao Zhu | 2025-09-23 |
| 12368115 | Supporting InFO packages to reduce warpage | Jie Chen, Hsien-Wei Chen | 2025-07-22 |
| 12362178 | Method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2025-07-15 |
| 12334459 | Integrated circuits | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2025-06-17 |
| 12331091 | Chimeric signal peptides for protein production | Chao-Yi Teng | 2025-06-17 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2025-06-10 |
| 12288802 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2025-04-29 |
| 12266637 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2025-04-01 |
| 12249580 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ming-Fa Chen | 2025-03-11 |
| 12218097 | Bonding to alignment marks with dummy alignment marks | Hsien-Wei Chen, Ming-Fa Chen | 2025-02-04 |
| 12211823 | Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang, Ming-Fa Chen, Sung-Feng Yeh | 2025-01-28 |
| 12211707 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ming-Fa Chen | 2025-01-28 |
| 12176270 | Package structure with photonic die and method | Hsien-Wei Chen, Ming-Fa Chen | 2024-12-24 |
| 12176248 | Wafer level dicing method and semiconductor device | Hsien-Wei Chen | 2024-12-24 |
| 12119338 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2024-10-15 |
| 12068241 | Semiconductor structure | Hsien-Wei Chen | 2024-08-20 |
| 12050216 | Method of detecting antibodies against JEV or ZIKV using recombinant baculoviruses expressing prM/e | Tzong-Yuan Wu, Szu-Cheng KUO, Pei-Yun SHU, Chang-Chi LIN, Der-Jiang CHIAO +3 more | 2024-07-30 |
| 12009386 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2024-06-11 |
| 12009335 | Structure and method of forming a joint assembly | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2024-06-11 |
| 11960675 | Display apparatus | Dongxin Qi, Aichen Xu, Caixia Zhao, Yuxin Zhang | 2024-04-16 |
| 11942436 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ming-Fa Chen | 2024-03-26 |
| 11908692 | Method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2024-02-20 |
| 11862590 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ming-Fa Chen | 2024-01-02 |
| 11862599 | Bonding to alignment marks with dummy alignment marks | Hsien-Wei Chen, Ming-Fa Chen | 2024-01-02 |
| 11848271 | Redistribution layer structures for integrated circuit package | Jie Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2023-12-19 |