Issued Patents All Time
Showing 1–25 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412841 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Szu-Wei Lu, Tsung-Fu Tsai | 2025-09-09 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2025-06-10 |
| 12255155 | Package structure with stacked semiconductor dies | Yi-Chao Mao, Szu-Wei Lu | 2025-03-18 |
| 12255079 | Semiconductor package and method of manufacturing the same | Szu-Wei Lu, Chen-Hua Yu | 2025-03-18 |
| 12131965 | Apparatus for detecting end point | Yi-Chao Mao, Szu-Wei Lu | 2024-10-29 |
| 12074112 | Package structure | Szu-Wei Lu | 2024-08-27 |
| 11996375 | Integrated circuit structure, and method for forming thereof | Yi-Chao Mao, Szu-Wei Lu, Kun-Tong Tsai, Hung Chih Chen | 2024-05-28 |
| 11948930 | Semiconductor package and method of manufacturing the same | Szu-Wei Lu, Chen-Hua Yu | 2024-04-02 |
| 11929261 | Semiconductor package and method of manufacturing the same | Szu-Wei Lu, Chen-Hua Yu | 2024-03-12 |
| 11862523 | Apparatus for detecting end point | Yi-Chao Mao, Szu-Wei Lu | 2024-01-02 |
| 11854984 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Szu-Wei Lu, Tsung-Fu Tsai | 2023-12-26 |
| 11728190 | System for thinning substrate | Yi-Chao Mao, Szu-Wei Lu | 2023-08-15 |
| 11670597 | Method for forming package structure | Szu-Wei Lu | 2023-06-06 |
| 11616034 | Integrated circuit structure, and method for forming thereof | Yi-Chao Mao, Szu-Wei Lu, Kun-Tong Tsai, Hung Chih Chen | 2023-03-28 |
| 11515288 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Tsei-Chung Fu, Jing-Cheng Lin | 2022-11-29 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |
| 11362046 | Semiconductor package | Jing-Cheng Lin, Jui-Pin Hung | 2022-06-14 |
| 11239180 | Structure and formation method of package structure with stacked semiconductor dies | Yi-Chao Mao, Szu-Wei Lu | 2022-02-01 |
| 11205579 | Molding wafer chamber | Jing-Cheng Lin, Jui-Pin Hung, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2021-12-21 |
| 11094635 | Package structure and method for forming the same | Szu-Wei Lu | 2021-08-17 |
| 11056364 | Method for substrate thinning | Yi-Chao Mao, Szu-Wei Lu | 2021-07-06 |
| 10964609 | Apparatus and method for detecting end point | Yi-Chao Mao, Szu-Wei Lu | 2021-03-30 |
| 10867897 | PoP device | Jing-Cheng Lin, Nai-Wei Liu, Wan-Ting Shih | 2020-12-15 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2020-10-20 |
| 10748869 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Tsei-Chung Fu, Jing-Cheng Lin | 2020-08-18 |