Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136597 | Semiconductor package having an interposer in which one or more dies are formed and method of forming the same | Yi-Lin Tsai, Wen-Sung Hsu | 2024-11-05 |
| 11948895 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, I-Hsuan Peng | 2024-04-02 |
| 11854784 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu, Shih-Chin Lin | 2023-12-26 |
| 11824020 | Semiconductor package structure including antenna | Yen-Yao Chi, Tzu-Hung Lin | 2023-11-21 |
| 11791266 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu | 2023-10-17 |
| 11742564 | Fan-out package structure with integrated antenna | Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu | 2023-08-29 |
| 11728292 | Semiconductor package assembly having a conductive electromagnetic shield layer | Tzu-Hung Lin, I-Hsuan Peng, Wei-Che Huang, Che-Ya Chou | 2023-08-15 |
| 11688655 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2023-06-27 |
| 11652273 | Innovative air gap for antenna fan out package | Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu | 2023-05-16 |
| 11574881 | Semiconductor package structure with antenna | Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu | 2023-02-07 |
| 11532577 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Jing-Cheng Lin, Cheng-Lin Huang | 2022-12-20 |
| 11508678 | Semiconductor package structure including antenna | Yen-Yao Chi, Tzu-Hung Lin | 2022-11-22 |
| 11450606 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Tzu-Hung Lin, Ta-Jen Yu, Wen-Sung Hsu | 2022-09-20 |
| 11410936 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, I-Hsuan Peng | 2022-08-09 |
| 11081453 | Semiconductor package structure with antenna | Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu | 2021-08-03 |
| 11043730 | Fan-out package structure with integrated antenna | Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu | 2021-06-22 |
| 11024954 | Semiconductor package with antenna and fabrication method thereof | Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu | 2021-06-01 |
| 10957611 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2021-03-23 |
| 10867897 | PoP device | Chin-Chuan Chang, Jing-Cheng Lin, Wan-Ting Shih | 2020-12-15 |
| 10784211 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, I-Hsuan Peng | 2020-09-22 |
| 10741511 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Jing-Cheng Lin, Cheng-Lin Huang | 2020-08-11 |
| 10692789 | Stacked fan-out package structure | Tzu-Hung Lin, I-Hsuan Peng, Ching-Wen Hsiao, Wei-Che Huang | 2020-06-23 |
| 10522439 | Semiconductor package device | Jui-Pin Hung, Jing-Cheng Lin | 2019-12-31 |
| 10483211 | Fan-out package structure and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng, Ching-Wen Hsiao, Wei-Che Huang | 2019-11-19 |
| 10468341 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou, Wei-Che Huang | 2019-11-05 |