Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300679 | Semiconductor package structure | Yi-Jyun Lee, Duen-Yi Ho, Hsing-Chih Liu | 2025-05-13 |
| 12230622 | Electronic device with stacked printed circuit boards | Ya-Lun Yang, Wen-Chou Wu | 2025-02-18 |
| 12230560 | Semiconductor package structure | Hsing-Chih Liu, Tai-Yu Chen | 2025-02-18 |
| 12165961 | Semiconductor package structure | Hsing-Chih Liu, Zheng Zeng | 2024-12-10 |
| 12021013 | Ball pad design for semiconductor packages | Chiang-Lin Yen | 2024-06-25 |
| 11908767 | Semiconductor package structure | Hsing-Chih Liu, Chia-Hao Hsu | 2024-02-20 |
| 11908759 | Semiconductor device | Nan-Cheng Chen, Che-Ya Chou, Hsing-Chih Liu | 2024-02-20 |
| 11887976 | Land-side silicon capacitor design and semiconductor package using the same | Yi-Jyun Lee | 2024-01-30 |
| 11776899 | Via array design for multi-layer redistribution circuit structure | Hsing-Chih Liu | 2023-10-03 |
| 11721882 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin +1 more | 2023-08-08 |
| 11710688 | Semiconductor package structure | Hsing-Chih Liu, Zheng Zeng | 2023-07-25 |
| 10847869 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin +1 more | 2020-11-24 |
| 10636773 | Semiconductor package structure and method for forming the same | Che-Ya Chou | 2020-04-28 |
| 10497678 | Semiconductor package assembly with passive device | Ying-Chih Chen, Che-Ya Chou | 2019-12-03 |
| 10468341 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Ya Chou, Wei-Che Huang | 2019-11-05 |
| 10199318 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Ya Chou, Wei-Che Huang | 2019-02-05 |
| 9818727 | Semiconductor package assembly with passive device | Ying-Chih Chen, Che-Ya Chou | 2017-11-14 |