Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12352000 | Laboratory experiment system for breaching of debris-typed barrier dam | Wengang Duan, Qigui Yang, Duan-Yu Chen, Yufang Ni, Qingyuan Yang +1 more | 2025-07-08 |
| 12237401 | Semiconductor chip | Cheng-Tien Wan, Yao-Tsung Huang, Yun-San Huang, Ming-Cheng Lee | 2025-02-25 |
| 11728292 | Semiconductor package assembly having a conductive electromagnetic shield layer | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu, Che-Ya Chou | 2023-08-15 |
| 11450756 | Manufacturing method of semiconductor chip | Cheng-Tien Wan, Yao-Tsung Huang, Yun-San Huang, Ming-Cheng Lee | 2022-09-20 |
| 11414415 | 6H-imidazo[4,5,1-ij]quinolone, synthesis method and use thereof | Pengfei Zhang, Chao Shen, Jun Xu, Jiabin Shen, Weiming Xu | 2022-08-16 |
| 11348900 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Ming-Tzong Yang | 2022-05-31 |
| 10790380 | Semiconductor chip and manufacturing method thereof | Cheng-Tien Wan, Yao-Tsung Huang, Yun-San Huang, Ming-Cheng Lee | 2020-09-29 |
| 10727202 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Ming-Tzong Yang | 2020-07-28 |
| 10692789 | Stacked fan-out package structure | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Ching-Wen Hsiao | 2020-06-23 |
| 10483211 | Fan-out package structure and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng, Ching-Wen Hsiao, Nai-Wei Liu | 2019-11-19 |
| 10468341 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou | 2019-11-05 |
| 10332830 | Semiconductor package assembly | Ming-Tzong Yang, Tzu-Hung Lin | 2019-06-25 |
| 10217723 | Semiconductor package with improved bandwidth | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu | 2019-02-26 |
| 10199318 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou | 2019-02-05 |
| 9947624 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Yu-Hua Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more | 2018-04-17 |
| 9941260 | Fan-out package structure having embedded package substrate | Tzu-Hung Lin, Chi-Chin Lien, Nai-Wei Liu, I-Hsuan Peng, Ching-Wen Hsiao | 2018-04-10 |
| 9899261 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Yu-Hua Huang, Tzu-Hung Lin | 2018-02-20 |
| 9870980 | Semiconductor package with through silicon via interconnect | Ming-Tzong Yang, Yu-Hua Huang | 2018-01-16 |
| 9786560 | Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Yu-Hua Huang, Tzu-Hung Lin | 2017-10-10 |
| 9712130 | Passive device cell and fabrication process thereof | Ming-Tzong Yang, Cheng-Chou Hung, Tung-Hsing Lee | 2017-07-18 |
| 9679842 | Semiconductor package assembly | Ming-Tzong Yang, Tzu-Hung Lin | 2017-06-13 |
| 9607894 | Radio-frequency device package and method for fabricating the same | Ming-Tzong Yang, Cheng-Chou Hung, Tung-Hsing Lee, Yu-Hua Huang | 2017-03-28 |
| 9570399 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Yu-Hua Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more | 2017-02-14 |
| 9543232 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Yu-Hua Huang, Tzu-Hung Lin | 2017-01-10 |
| 9524948 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Ming-Tzong Yang | 2016-12-20 |