Issued Patents All Time
Showing 25 most recent of 100 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191226 | Method of manufacturing heat dissipation substrate with high thermal conductivity for semiconductor device | Hsien-Hsin Lin, Wen-Kai Wan, Chia-Che CHUNG, Chee-Wee Liu | 2025-01-07 |
| 11587846 | Semiconductor device and method of forming the same | Hsien-Hsin Lin, Wen-Kai Wan, Chia-Che CHUNG, Chee-Wee Liu | 2023-02-21 |
| 11348900 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang | 2022-05-31 |
| 10741469 | Thermal via arrangement for multi-channel semiconductor device | Hsien-Hsin Lin, Wen-Kai Wan | 2020-08-11 |
| 10727202 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang | 2020-07-28 |
| 10361173 | Semiconductor package assemblies with system-on-chip (SOC) packages | Tzu-Hung Lin | 2019-07-23 |
| 10332830 | Semiconductor package assembly | Wei-Che Huang, Tzu-Hung Lin | 2019-06-25 |
| 9947624 | Semiconductor package assembly with through silicon via interconnect | Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more | 2018-04-17 |
| 9899261 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin | 2018-02-20 |
| 9870980 | Semiconductor package with through silicon via interconnect | Yu-Hua Huang, Wei-Che Huang | 2018-01-16 |
| 9859192 | Semiconductor structure with through-silicon via | Yu-Hua Huang | 2018-01-02 |
| 9786560 | Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same | Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin | 2017-10-10 |
| 9712130 | Passive device cell and fabrication process thereof | Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang | 2017-07-18 |
| 9679842 | Semiconductor package assembly | Wei-Che Huang, Tzu-Hung Lin | 2017-06-13 |
| 9640489 | Seal ring structure with capacitor | Cheng-Chou Hung, Tung-Hsing Lee, Yu-Hua Huang | 2017-05-02 |
| 9607894 | Radio-frequency device package and method for fabricating the same | Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang | 2017-03-28 |
| 9570399 | Semiconductor package assembly with through silicon via interconnect | Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more | 2017-02-14 |
| 9548289 | Semiconductor package assemblies with system-on-chip (SOC) packages | Tzu-Hung Lin | 2017-01-17 |
| 9543232 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin | 2017-01-10 |
| 9524948 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang | 2016-12-20 |
| 9425098 | Radio-frequency device package and method for fabricating the same | Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang | 2016-08-23 |
| 9373727 | Semiconductor diode | Tung-Hsing Lee | 2016-06-21 |
| 9269664 | Semiconductor package with through silicon via interconnect and method for fabricating the same | Cheng-Chou Hung, Yu-Hua Huang, Wei-Che Huang | 2016-02-23 |
| 9257392 | Semiconductor package with through silicon via interconnect | Yu-Hua Huang, Wei-Che Huang | 2016-02-09 |
| 9190976 | Passive device cell and fabrication process thereof | Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang | 2015-11-17 |