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Method of manufacturing heat dissipation substrate with high thermal conductivity for semiconductor device |
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Hsien-Hsin Lin, Wen-Kai Wan, Chia-Che CHUNG, Chee-Wee Liu |
2023-02-21 |
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| 11348900 |
Package structure |
Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang |
2022-05-31 |
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| 10741469 |
Thermal via arrangement for multi-channel semiconductor device |
Hsien-Hsin Lin, Wen-Kai Wan |
2020-08-11 |
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| 10727202 |
Package structure |
Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang |
2020-07-28 |
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| 10361173 |
Semiconductor package assemblies with system-on-chip (SOC) packages |
Tzu-Hung Lin |
2019-07-23 |
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| 10332830 |
Semiconductor package assembly |
Wei-Che Huang, Tzu-Hung Lin |
2019-06-25 |
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| 9947624 |
Semiconductor package assembly with through silicon via interconnect |
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2018-04-17 |
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| 9899261 |
Semiconductor package structure and method for forming the same |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin |
2018-02-20 |
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| 9870980 |
Semiconductor package with through silicon via interconnect |
Yu-Hua Huang, Wei-Che Huang |
2018-01-16 |
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| 9859192 |
Semiconductor structure with through-silicon via |
Yu-Hua Huang |
2018-01-02 |
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| 9786560 |
Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin |
2017-10-10 |
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| 9712130 |
Passive device cell and fabrication process thereof |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang |
2017-07-18 |
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| 9679842 |
Semiconductor package assembly |
Wei-Che Huang, Tzu-Hung Lin |
2017-06-13 |
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| 9640489 |
Seal ring structure with capacitor |
Cheng-Chou Hung, Tung-Hsing Lee, Yu-Hua Huang |
2017-05-02 |
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| 9607894 |
Radio-frequency device package and method for fabricating the same |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang |
2017-03-28 |
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| 9570399 |
Semiconductor package assembly with through silicon via interconnect |
Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more |
2017-02-14 |
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| 9548289 |
Semiconductor package assemblies with system-on-chip (SOC) packages |
Tzu-Hung Lin |
2017-01-17 |
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| 9543232 |
Semiconductor package structure and method for forming the same |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin |
2017-01-10 |
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| 9524948 |
Package structure |
Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang |
2016-12-20 |
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| 9425098 |
Radio-frequency device package and method for fabricating the same |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang |
2016-08-23 |
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| 9373727 |
Semiconductor diode |
Tung-Hsing Lee |
2016-06-21 |
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| 9269664 |
Semiconductor package with through silicon via interconnect and method for fabricating the same |
Cheng-Chou Hung, Yu-Hua Huang, Wei-Che Huang |
2016-02-23 |
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| 9257392 |
Semiconductor package with through silicon via interconnect |
Yu-Hua Huang, Wei-Che Huang |
2016-02-09 |
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| 9190976 |
Passive device cell and fabrication process thereof |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang |
2015-11-17 |
|