Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package assemblies with system-on-chip (SOC) packages

Semiconductor package assemblies with system-on-chip (SOC) packages

US Patent 10361173 · Granted Jul 23, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package structure2025
Method of manufacturing heat dissipation substrate with high thermal conductivit2025
Semiconductor package structure having an annular frame with truncated corners2024
Semiconductor package structure2024
Semiconductor package structure2024
Semiconductor package structure2024
Semiconductor package structure2024
Chip scale package structure and method of forming the same2023
Semiconductor package structure including antenna2023
Chip scale package structure and method of forming the same2023
Fan-out package structure with integrated antenna2023
Semiconductor package assembly having a conductive electromagnetic shield layer2023