Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218850 | Transmission rate management method and device | Yuan-Ting Huang, Kai Liu | 2025-02-04 |
| 11805054 | Method and electronic device for saving power applied to a router | Ming-Jun Lin, Huei-Jing Yang, Kai Liu, Yuan-Ting Huang | 2023-10-31 |
| 11736998 | Method for preventing an inter-rat change from being triggered and communications apparatus utilizing the same | Guan-Jie HUANG, Tzu-Wen Chang, Kuan-Wei Chen, Teng MA, Sheng-Kai Chang | 2023-08-22 |
| 11582822 | Apparatuses and methods for coordinating operations associated with multiple subscriber identities | Chin-Wei Hsu | 2023-02-14 |
| 11424204 | Semiconductor component and manufacturing method thereof | Po-Chao Tsao | 2022-08-23 |
| 11348900 | Package structure | Tzu-Hung Lin, Wei-Che Huang, Ming-Tzong Yang | 2022-05-31 |
| 11262524 | Lens structure | Chen-Cheng Lee, Chih-Wei Chang, Tzu-Lun Wang | 2022-03-01 |
| 11140593 | Method for preventing an inter-RAT change from being triggered and communications apparatus utilizing the same | Guan-Jie HUANG, Tzu-Wen Chang, Kuan-Wei Chen, Teng MA, Sheng-Kai Chang | 2021-10-05 |
| 10727202 | Package structure | Tzu-Hung Lin, Wei-Che Huang, Ming-Tzong Yang | 2020-07-28 |
| 10170435 | Guard ring structure and method for forming the same | Chiyuan Lu, Chien-Chih Lin, Cheng-Chou Hung | 2019-01-01 |
| 9947624 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more | 2018-04-17 |
| 9947627 | Guard ring structure and method for forming the same | Chiyuan Lu, Chien-Chih Lin, Cheng-Chou Hung | 2018-04-17 |
| 9899261 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Tzu-Hung Lin | 2018-02-20 |
| 9870980 | Semiconductor package with through silicon via interconnect | Ming-Tzong Yang, Wei-Che Huang | 2018-01-16 |
| 9859192 | Semiconductor structure with through-silicon via | Ming-Tzong Yang | 2018-01-02 |
| 9786560 | Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Tzu-Hung Lin | 2017-10-10 |
| 9640489 | Seal ring structure with capacitor | Cheng-Chou Hung, Tung-Hsing Lee, Ming-Tzong Yang | 2017-05-02 |
| 9607894 | Radio-frequency device package and method for fabricating the same | Ming-Tzong Yang, Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang | 2017-03-28 |
| 9570399 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more | 2017-02-14 |
| 9543232 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Tzu-Hung Lin | 2017-01-10 |
| 9524948 | Package structure | Tzu-Hung Lin, Wei-Che Huang, Ming-Tzong Yang | 2016-12-20 |
| 9425098 | Radio-frequency device package and method for fabricating the same | Ming-Tzong Yang, Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang | 2016-08-23 |
| 9397032 | Guard ring structure and method for forming the same | Chiyuan Lu, Chien-Chih Lin, Cheng-Chou Hung | 2016-07-19 |
| 9269664 | Semiconductor package with through silicon via interconnect and method for fabricating the same | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang | 2016-02-23 |
| 9257392 | Semiconductor package with through silicon via interconnect | Ming-Tzong Yang, Wei-Che Huang | 2016-02-09 |