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Right-angle turning method for small-diameter TBM exploration adit excavation |
Youlin Wang, Yongshun Liu, Junheng Cao, Jian Jiao, Shuwu Li +8 more |
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Che-Ya Chou, Hsing-Chih Liu, Che-Hung Kuo |
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Antenna-in-package with frequency-selective surface structure |
Shih-Chia Chiu, Yen-Ju Lu, Wen-Chou Wu |
2023-12-19 |
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Wen-Sung Hsu, Tao Cheng, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more |
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Semiconductor package having discrete antenna device |
Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Min-Chen Lin +1 more |
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Product features map |
June-Ray Lin, Ju Ling Liu, Li Wang, Shun Xian Wu |
2023-06-13 |
$5,486,000 |
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Semiconductor package with layer structures, antenna layer and electronic component |
Wen-Sung Hsu, Tao Cheng, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more |
2022-06-28 |
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Antenna-in-package with frequency-selective surface structure |
Shih-Chia Chiu, Yen-Ju Lu, Wen-Chou Wu |
2022-05-03 |
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| 10991669 |
Semiconductor package using flip-chip technology |
Che-Ya Chou, Wen-Sung Hsu |
2021-04-27 |
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Semiconductor package having discrete antenna device |
Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Min-Chen Lin +1 more |
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Semiconductor package |
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Over the air wireless test system for testing microelectronic devices integrated with antenna |
Yen-Ju Lu, Chih-Ming Hung, Wen-Chou Wu |
2020-06-09 |
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Fan-out package structure having stacked carrier substrates and method for forming the same |
Shih-Yi Syu, Chia-Yu Jin, Che-Ya Chou, Wen-Sung Hsu |
2019-12-24 |
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| 10128192 |
Fan-out package structure |
Min-Chen Lin, Che-Ya Chou |
2018-11-13 |
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| 10103128 |
Semiconductor package incorporating redistribution layer interposer |
Che-Ya Chou, Kun-Ting Hung, Chia-Hao Yang |
2018-10-16 |
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Layout method for printed circuit board |
Fu-Kang Pan, Shih-Chieh Lin, Hui-Chi Tang, Ying-Lin Liu, Yang Liu +1 more |
2017-12-19 |
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Printed circuit board for mobile platforms |
Sheng-Ming Chang, Shih-Chieh Lin |
2017-06-06 |
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Semiconductor package assembly with decoupling capacitor |
Sheng-Ming Chang, Tung-Hsien Hsieh |
2016-05-03 |
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Fan-out semiconductor package with copper pillar bumps |
Che-Ya Chou |
2015-10-20 |
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Layout method for printed circuit board |
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2015-10-13 |
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Printed circuit board for mobile platforms |
Sheng-Ming Chang, Shih-Chieh Lin |
2015-09-08 |
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Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof |
Chung-Er Huang |
2014-06-10 |
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Leadframe package for high-speed data rate applications |
Nan-Jang Chen, Chun-Wei Chang, Sheng-Ming Chang, Che-Yuan Jao, Ching-Chih Li |
2013-09-03 |
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Package-on-package with fan-out WLCSP |
Chih-Tai Hsu |
2012-11-13 |
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Quad flat package with exposed common electrode bars |
Nan-Jang Chen, Ching-Chih Li |
2012-10-09 |
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