Issued Patents All Time
Showing 25 most recent of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837552 | Semiconductor package with layer structures, antenna layer and electronic component | Wen-Sung Hsu, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2023-12-05 |
| 11644872 | Portable electronic device | Shih-Yao Lin, Tsung-Cheng Lin, Wen-Chung Wu, Pei-Yi Lee | 2023-05-09 |
| 11373957 | Semiconductor package with layer structures, antenna layer and electronic component | Wen-Sung Hsu, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2022-06-28 |
| 11353925 | Portable electronic device | Shih-Yao Lin, Tsung-Cheng Lin, Wen-Chung Wu, Pei-Yi Lee, Chia-Liang Chiang | 2022-06-07 |
| 10984787 | Multimedia apparatus and multimedia system | Po-Chun Chen, Tzu-Fang Huang, Chung-Kuan Wang, Chia-Ching Chen, Kuang-Hsun Hsieh +4 more | 2021-04-20 |
| 10879759 | Stator assembly and stepper drive motor including same | Kun Chen | 2020-12-29 |
| 10784206 | Semiconductor package | Wen-Sung Hsu, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2020-09-22 |
| 10354974 | Structure and formation method of chip package structure | Wen-Sung Hsu, Shih-Chin Lin, Andrew C. Chang | 2019-07-16 |
| 10312222 | Semiconductor package and semiconductor device using the same | Wen-Sung Hsu, Shih-Chin Lin | 2019-06-04 |
| 10186488 | Manufacturing method of semiconductor package and manufacturing method of semiconductor device | Wen-Sung Hsu, Shih-Chin Lin, Andrew C. Chang | 2019-01-22 |
| 10002833 | Power and ground routing of integrated circuit devices with improved IR drop and chip performance | Ching-Chung Ko, Tien-Yueh Liu, Ta-Hsi Chou, Peng-Cheng Kao, Ling-Wei Ke | 2018-06-19 |
| 9908203 | Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin | 2018-03-06 |
| 9905515 | Integrated circuit stress releasing structure | Chin-Chiang Chang | 2018-02-27 |
| 9881902 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin | 2018-01-30 |
| 9779880 | Resin composition and dielectric layer and capacitor produced therefrom | Qilin Chen, Zhou Jin | 2017-10-03 |
| 9761534 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin, Andrew C. Chang | 2017-09-12 |
| 9698102 | Power and ground routing of integrated circuit devices with improved IR drop and chip performance | Ching-Chung Ko, Tien-Yueh Liu, Ta-Hsi Chou, Peng-Cheng Kao, Ling-Wei Ke | 2017-07-04 |
| 9597752 | Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin | 2017-03-21 |
| 9574878 | Terminal device having hand shaking sensing units to determine the manner that a user holds the terminal device | Qian Zhao, Hanfeng Zheng, Hao Chen, Yufei Zhang, Chenghu Wu +2 more | 2017-02-21 |
| 9455088 | Resin composition and dielectric layer and capacitor produced therefrom | Qilin Chen, Zhou Jin | 2016-09-27 |
| 9379059 | Power and ground routing of integrated circuit devices with improved IR drop and chip performance | Ching-Chung Ko, Tien-Yueh Liu, Ta-Hsi Chou, Peng-Cheng Kao, Ling-Wei Ke | 2016-06-28 |
| 9198281 | Leadframe for semiconductor packages | — | 2015-11-24 |
| 8860544 | Integrated inductor | Ching-Chung Ko, Tung-Hsing Lee, Kuei-Ti Chan, Ming-Tzong Yang | 2014-10-14 |
| 8587056 | High-voltage metal-oxide-semiconductor device | Ming-Cheng Lee, Ming-Tzong Yang | 2013-11-19 |
| 8242586 | Integrated circuit chip with seal ring structure | Tien-Chang Chang, Shi-Bai Chen, Yu-Hua Huang | 2012-08-14 |