AC

Andrew C. Chang

ME Mediatek: 14 patents #178 of 2,888Top 7%
Apple: 4 patents #6,306 of 18,612Top 35%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
Overall (All Time): #200,181 of 4,157,543Top 5%
21
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12308670 Wireless power system with communications Parin Patel, Daniel P. Kumar 2025-05-20
12308671 Wireless power system with communications Parin Patel, Daniel P. Kumar 2025-05-20
12222794 Management of near field communications using a low power express mode of an electronic device Yong Wang, Gordon Y. Scott, Scott Alan Williams 2025-02-11
11693467 Electronic device functionality in low power mode Langford M. Wasada, Arun Unkn, Sriram Hariharan, Robert W. Brumley, Raman S. Thiara 2023-07-04
11469201 Semiconductor package and method for fabricating base for semiconductor package Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu 2022-10-11
11121590 Wireless power system with communications Parin Patel, Daniel P. Kumar 2021-09-14
11086387 Management of near field communications using a low power express mode of an electronic device Yong Wang, Gordon Y. Scott, Scott Alan Williams 2021-08-10
10580747 Semiconductor package and method for fabricating base for semiconductor package Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu 2020-03-03
10573616 Semiconductor package and method for fabricating base for semiconductor package Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu 2020-02-25
10573615 Semiconductor package and method for fabricating base for semiconductor package Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu 2020-02-25
10354974 Structure and formation method of chip package structure Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng 2019-07-16
10186488 Manufacturing method of semiconductor package and manufacturing method of semiconductor device Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng 2019-01-22
9761534 Semiconductor package, semiconductor device using the same and manufacturing method thereof Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng 2017-09-12
9177899 Semiconductor package and method for fabricating base for semiconductor package Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu 2015-11-03
9040359 Molded interposer package and method for fabricating the same Thomas Matthew Gregorich, Tzu-Hung Lin 2015-05-26
8957518 Molded interposer package and method for fabricating the same Thomas Matthew Gregorich, Tzu-Hung Lin 2015-02-17
8859340 Molded interposer package and method for fabricating the same Thomas Matthew Gregorich, Tzu-Hung Lin 2014-10-14
7193944 Information recording device and method of the same 2007-03-20
6928038 Circuit for protecting synchronizing patterns Chao-Long Tsai, Szu-Shan Lo 2005-08-09
6496126 Digitization apparatus and method using a finite state machine in feedback loop Jing-Hong Conan Zhan, Chi-Kwong Ho 2002-12-17
5974088 Digital data slicer 1999-10-26