Issued Patents All Time
Showing 25 most recent of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300573 | Semiconductor device and manufacturing method thereof | Bo-Jiun Yang, Tai-Yu Chen, Sheng-Liang Kuo, Chia-Hao Hsu | 2025-05-13 |
| 12136597 | Semiconductor package having an interposer in which one or more dies are formed and method of forming the same | Yi-Lin Tsai, Nai-Wei Liu | 2024-11-05 |
| 12080614 | Lidded semiconductor package | Shih-Chao Chiu, Chi-Yuan Chen, Ya-Jui Hsieh, Yao-Pang Hsu, Wen-Chun Huang | 2024-09-03 |
| 12021068 | Semiconductor device with dummy thermal features on interposer | Bo-Jiun Yang, Tai-Yu Chen, Shih-Chin Lin, Kun-Ting Hung | 2024-06-25 |
| 12021031 | Semiconductor package structure | Yi-Lin Tsai, Yi-Jou Lin, I-Hsuan Peng | 2024-06-25 |
| 11854784 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Shih-Chin Lin | 2023-12-26 |
| 11854930 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, Yi-Jou Lin, I-Hsuan Peng | 2023-12-26 |
| 11837552 | Semiconductor package with layer structures, antenna layer and electronic component | Tao Cheng, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2023-12-05 |
| 11830851 | Semiconductor package structure | Yi-Lin Tsai, I-Hsuan Peng, Yi-Jou Lin | 2023-11-28 |
| 11791266 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin | 2023-10-17 |
| 11742564 | Fan-out package structure with integrated antenna | Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin | 2023-08-29 |
| 11670596 | Semiconductor package structure | Yi-Lin Tsai, I-Hsuan Peng, Yi-Jou Lin | 2023-06-06 |
| 11652273 | Innovative air gap for antenna fan out package | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin | 2023-05-16 |
| 11574881 | Semiconductor package structure with antenna | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin | 2023-02-07 |
| 11469201 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Ta-Jen Yu, Andrew C. Chang | 2022-10-11 |
| 11469152 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, Yi-Jou Lin, I-Hsuan Peng | 2022-10-11 |
| 11450606 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin, Ta-Jen Yu | 2022-09-20 |
| 11373957 | Semiconductor package with layer structures, antenna layer and electronic component | Tao Cheng, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2022-06-28 |
| 11081453 | Semiconductor package structure with antenna | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin | 2021-08-03 |
| 11043730 | Fan-out package structure with integrated antenna | Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin | 2021-06-22 |
| 11024954 | Semiconductor package with antenna and fabrication method thereof | Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin | 2021-06-01 |
| 10991669 | Semiconductor package using flip-chip technology | Che-Ya Chou, Nan-Cheng Chen | 2021-04-27 |
| 10978406 | Semiconductor package including EMI shielding structure and method for forming the same | Hung-Jen Chang, Jen-Chuan Chen, Hsueh-Te Wang | 2021-04-13 |
| 10916449 | Semiconductor package and method for fabricating base for semiconductor package | Ta-Jen Yu | 2021-02-09 |
| 10784206 | Semiconductor package | Tao Cheng, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2020-09-22 |