Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388194 | Antenna-in-module package-on-package with air trenches | Ya-Jui Hsieh, Chi-Yuan Chen, Yao-Pang Hsu | 2025-08-12 |
| 12080614 | Lidded semiconductor package | Chi-Yuan Chen, Wen-Sung Hsu, Ya-Jui Hsieh, Yao-Pang Hsu, Wen-Chun Huang | 2024-09-03 |
| 10141266 | Method of fabricating semiconductor package structure | Yu-Cheng Pai, Wei-Chung Hsiao, Chun-Hsien Lin, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-11-27 |
| 10068842 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-09-04 |
| 10043757 | Semiconductor package structure and method of fabricating the same | Yu-Cheng Pai, Wei-Chung Hsiao, Chun-Hsien Lin, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-08-07 |
| 10002825 | Method of fabricating package structure with an embedded electronic component | Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-06-19 |
| 9905438 | Method of manufacturing package substrate and semiconductor package | Ming-Chen Sun, Chun-Hsien Lin, Tzu-Chieh Shen, Yu-Cheng Pai | 2018-02-27 |
| 9899249 | Fabrication method of coreless packaging substrate | Yu-Cheng Pai, Chun-Hsien Lin, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-02-20 |
| 9735080 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-08-15 |
| 9716060 | Package structure with an embedded electronic component and method of fabricating the package structure | Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-07-25 |
| 9673140 | Package structure having a laminated release layer and method for fabricating the same | Chia-Cheng Chen, Ming-Chen Sun, Tzu-Chieh Shen, Wei-Chung Hsiao, Yu-Cheng Pai +1 more | 2017-06-06 |
| 9640503 | Package substrate, semiconductor package and method of manufacturing the same | Ming-Chen Sun, Chun-Hsien Lin, Tzu-Chieh Shen, Yu-Cheng Pai | 2017-05-02 |
| 9510463 | Coreless packaging substrate and fabrication method thereof | Yu-Cheng Pai, Chun-Hsien Lin, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2016-11-29 |
| 9490225 | Package structure and fabrication method thereof | Wei-Chung Hsiao, Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun | 2016-11-08 |
| 9082723 | Semiconductor package and fabrication method thereof | Tzu-Chieh Chen, Chia-Cheng Chen | 2015-07-14 |