Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239125 | Carrier structure and package structure | Hsien-Lung Hsiao, Chia-Chi Lo, Szu-Hsien Chen, Shu-Chi Chang | 2022-02-01 |
| 11205644 | Method for fabricating electronic package | Chi-Rui Wu, Fu-Tang Huang, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi | 2021-12-21 |
| 10629572 | Electronic package and method for fabricating the same | Chi-Rui Wu, Fu-Tang Huang, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi | 2020-04-21 |
| 10147615 | Fabrication method of package structure | — | 2018-12-04 |
| 10141266 | Method of fabricating semiconductor package structure | Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-11-27 |
| 10096491 | Method of fabricating a packaging substrate including a carrier having two carrying portions | Chun-Hsien Lin, Wei-Chung Hsiao, Ming-Chen Sun, Liang-Yi Hung | 2018-10-09 |
| 10068842 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-09-04 |
| 10043757 | Semiconductor package structure and method of fabricating the same | Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-08-07 |
| 10002825 | Method of fabricating package structure with an embedded electronic component | Shih-Chao Chiu, Chun-Hsien Lin, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-06-19 |
| 9905438 | Method of manufacturing package substrate and semiconductor package | Ming-Chen Sun, Chun-Hsien Lin, Tzu-Chieh Shen, Shih-Chao Chiu | 2018-02-27 |
| 9899249 | Fabrication method of coreless packaging substrate | Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2018-02-20 |
| 9735080 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-08-15 |
| 9716060 | Package structure with an embedded electronic component and method of fabricating the package structure | Shih-Chao Chiu, Chun-Hsien Lin, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-07-25 |
| 9673140 | Package structure having a laminated release layer and method for fabricating the same | Chia-Cheng Chen, Ming-Chen Sun, Tzu-Chieh Shen, Shih-Chao Chiu, Wei-Chung Hsiao +1 more | 2017-06-06 |
| 9640503 | Package substrate, semiconductor package and method of manufacturing the same | Ming-Chen Sun, Chun-Hsien Lin, Tzu-Chieh Shen, Shih-Chao Chiu | 2017-05-02 |
| 9607860 | Electronic package structure and fabrication method thereof | — | 2017-03-28 |
| 9510463 | Coreless packaging substrate and fabrication method thereof | Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2016-11-29 |
| 9490225 | Package structure and fabrication method thereof | Wei-Chung Hsiao, Chun-Hsien Lin, Ming-Chen Sun, Shih-Chao Chiu | 2016-11-08 |
| 9112063 | Fabrication method of semiconductor package | Wei-Chung Hsiao, Chun-Hsien Lin, Liang-Yi Hung, Ming-Chen Sun, Shao-Tzu Tang +2 more | 2015-08-18 |
| 8796867 | Semiconductor package and fabrication method thereof | Wei-Chung Hsiao, Chun-Hsien Lin, Liang-Yi Hung, Ming-Chen Sun, Shao-Tzu Tang +2 more | 2014-08-05 |
| 8471383 | Semiconductor package and fabrication method thereof | Liang-Yi Hung, Ming-Chen Sun, Chun-Hsien Lin | 2013-06-25 |