Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239125 | Carrier structure and package structure | Hsien-Lung Hsiao, Yu-Cheng Pai, Szu-Hsien Chen, Shu-Chi Chang | 2022-02-01 |
| 8837808 | Method of final defect inspection | Cheng-Hsiung Yang, Jun Chung Hsu | 2014-09-16 |
| 8547548 | Final defect inspection system | Cheng-Hsiung Yang, Jun Chung Hsu | 2013-10-01 |
| 8186054 | Method of fabricating board having high density core layer and structure thereof | Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Yu-Te Lu | 2012-05-29 |
| 7875809 | Method of fabricating board having high density core layer and structure thereof | Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Yu-Te Lu | 2011-01-25 |