| 11044806 |
Method for manufacturing multi-layer circuit board capable of being applied with electrical testing |
Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Chin-Hsi Chang |
2021-06-22 |
| 10548214 |
Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same |
Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Chin-Hsi Chang |
2020-01-28 |
| 10455694 |
Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing |
Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Chin-Hsi Chang |
2019-10-22 |
| 10334719 |
Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same |
Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Chin-Hsi Chang |
2019-06-25 |
| 9831167 |
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof |
Ting-Hao Lin, Yi-Fan Kao, Shuo-Hsun Chang, Kuo-Chun Huang |
2017-11-28 |
| 9754870 |
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof |
Ting-Hao Lin, Yi-Fan Kao, Shuo-Hsun Chang, Kuo-Chun Huang |
2017-09-05 |
| 9406641 |
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof |
Ting-Hao Lin, Yi-Fan Kao, Shuo-Hsun Chang, Kuo-Chun Huang |
2016-08-02 |
| 9370110 |
Method of manufacturing a multilayer substrate structure for fine line |
Ting-Hao Lin |
2016-06-14 |
| 9301405 |
Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole |
Ting-Hao Lin, Yi-Fan Kao, Jaen-Don Lan, Yung-Lin Chia, An-Ping Tseng |
2016-03-29 |
| 9198296 |
Double sided board with buried element and method for manufacturing the same |
Ting-Hao Lin, Fu-Song Chen |
2015-11-24 |
| 9095084 |
Stacked multilayer structure |
Ting-Hao Lin, De-Hao Lu |
2015-07-28 |
| 9095085 |
Method of manufacturing a stacked multilayer structure |
Ting-Hao Lin, De-Hao Lu |
2015-07-28 |
| 8941224 |
Package structure of a chip and a substrate |
Ting-Hao Lin, De-Hao Lu |
2015-01-27 |
| 8887386 |
Method of manufacturing a chip support board structure |
Ting-Hao Lin, De-Hao Lu |
2014-11-18 |
| 8875390 |
Method of manufacturing a laminate circuit board |
Ting-Hao Lin, De-Hao Lu |
2014-11-04 |
| 8766102 |
Chip support board structure |
Ting-Hao Lin, De-Hao Lu |
2014-07-01 |
| 8186054 |
Method of fabricating board having high density core layer and structure thereof |
Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Chia-Chi Lo |
2012-05-29 |
| 8161639 |
Method for fabricating an interlayer conducting structure of an embedded circuitry |
Chien-Wei Chang, Ting-Hao Lin |
2012-04-24 |
| 8083954 |
Method for fabricating component-embedded printed circuit board |
Chien-Wei Chang, Ting-Hao Lin |
2011-12-27 |
| 7875809 |
Method of fabricating board having high density core layer and structure thereof |
Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Chia-Chi Lo |
2011-01-25 |
| 7871892 |
Method for fabricating buried capacitor structure |
Chien-Wei Chang, Ting-Hao Lin, Ya-Hsiang Chen |
2011-01-18 |