Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11044806 | Method for manufacturing multi-layer circuit board capable of being applied with electrical testing | Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Chin-Hsi Chang | 2021-06-22 |
| 10548214 | Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same | Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Chin-Hsi Chang | 2020-01-28 |
| 10455694 | Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing | Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Chin-Hsi Chang | 2019-10-22 |
| 10334719 | Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same | Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Chin-Hsi Chang | 2019-06-25 |
| 9831167 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Shuo-Hsun Chang, Kuo-Chun Huang | 2017-11-28 |
| 9754870 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Shuo-Hsun Chang, Kuo-Chun Huang | 2017-09-05 |
| 9406641 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Shuo-Hsun Chang, Kuo-Chun Huang | 2016-08-02 |
| 9370110 | Method of manufacturing a multilayer substrate structure for fine line | Ting-Hao Lin | 2016-06-14 |
| 9301405 | Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole | Ting-Hao Lin, Yi-Fan Kao, Jaen-Don Lan, Yung-Lin Chia, An-Ping Tseng | 2016-03-29 |
| 9198296 | Double sided board with buried element and method for manufacturing the same | Ting-Hao Lin, Fu-Song Chen | 2015-11-24 |
| 9095084 | Stacked multilayer structure | Ting-Hao Lin, De-Hao Lu | 2015-07-28 |
| 9095085 | Method of manufacturing a stacked multilayer structure | Ting-Hao Lin, De-Hao Lu | 2015-07-28 |
| 8941224 | Package structure of a chip and a substrate | Ting-Hao Lin, De-Hao Lu | 2015-01-27 |
| 8887386 | Method of manufacturing a chip support board structure | Ting-Hao Lin, De-Hao Lu | 2014-11-18 |
| 8875390 | Method of manufacturing a laminate circuit board | Ting-Hao Lin, De-Hao Lu | 2014-11-04 |
| 8766102 | Chip support board structure | Ting-Hao Lin, De-Hao Lu | 2014-07-01 |
| 8186054 | Method of fabricating board having high density core layer and structure thereof | Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Chia-Chi Lo | 2012-05-29 |
| 8161639 | Method for fabricating an interlayer conducting structure of an embedded circuitry | Chien-Wei Chang, Ting-Hao Lin | 2012-04-24 |
| 8083954 | Method for fabricating component-embedded printed circuit board | Chien-Wei Chang, Ting-Hao Lin | 2011-12-27 |
| 7875809 | Method of fabricating board having high density core layer and structure thereof | Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Chia-Chi Lo | 2011-01-25 |
| 7871892 | Method for fabricating buried capacitor structure | Chien-Wei Chang, Ting-Hao Lin, Ya-Hsiang Chen | 2011-01-18 |