Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8754328 | Laminate circuit board with a multi-layer circuit structure | Jun Chung Hsu, Chi-Ming Lin, Tso-Hung Yeh | 2014-06-17 |
| 8377815 | Manufacturing method of a semiconductor load board | Chien-Wei Chang, Ting-Hao Lin | 2013-02-19 |
| 8312624 | Method for manufacturing a heat dissipation structure of a printed circuit board | Chien-Wei Chang, Ting-Hao Lin, De-Hao Lu | 2012-11-20 |
| 7871892 | Method for fabricating buried capacitor structure | Chien-Wei Chang, Ting-Hao Lin, Yu-Te Lu | 2011-01-18 |