Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322721 | Asymmetric Stackup Structure for SoC package substrates | Yikang Deng, Taegui Kim, Yifan Kao | 2025-06-03 |
| 11908819 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim | 2024-02-20 |
| 11862597 | Asymmetric stackup structure for SoC package substrates | Yikang Deng, Taegui Kim, Yifan Kao | 2024-01-02 |
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim | 2023-01-03 |
| 10991659 | Substrate-less integrated components | Flynn Carson, Meng Chi Lee, Shatki S. Chauhan | 2021-04-27 |
| 10535611 | Substrate-less integrated components | Flynn Carson, Meng Chi Lee, Shakti Singh Chauhan | 2020-01-14 |
| 10522475 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin | 2019-12-31 |
| 10115677 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin | 2018-10-30 |
| 10109593 | Self shielded system in package (SiP) modules | Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin | 2018-10-23 |
| 9899239 | Carrier ultra thin substrate | Flynn Carson, Kwan-Yu Lai | 2018-02-20 |
| 9721903 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin | 2017-08-01 |
| 9633953 | Methodology to achieve zero warpage for IC package | Jie Zhao | 2017-04-25 |
| 9570367 | Ultra fine pitch PoP coreless package | Jun Zhai | 2017-02-14 |
| 9351409 | Method of manufacturing a thin support package structure | Hsueh-Ping Chien | 2016-05-24 |
| 9305853 | Ultra fine pitch PoP coreless package | Jun Zhai | 2016-04-05 |
| 8837808 | Method of final defect inspection | Chia-Chi Lo, Cheng-Hsiung Yang | 2014-09-16 |
| 8754328 | Laminate circuit board with a multi-layer circuit structure | Chi-Ming Lin, Tso-Hung Yeh, Ya-Hsiang Chen | 2014-06-17 |
| 8547548 | Final defect inspection system | Chia-Chi Lo, Cheng-Hsiung Yang | 2013-10-01 |
| 8315063 | Solder pad structure with high bondability to solder ball | — | 2012-11-20 |
| 7805835 | Method for selectively processing surface tension of solder mask layer in circuit board | Hsien-Ming Dai, Jen-Fang Chang | 2010-10-05 |
| 7768131 | Package structure preventing solder overflow on substrate solder pads | Chen-Lin Li | 2010-08-03 |
| 7662662 | Method for manufacturing carrier substrate | Bing-Kuen Lin, Chao-Lung Wang | 2010-02-16 |