JH

Jun Chung Hsu

Apple: 14 patents #2,325 of 18,612Top 15%
KT Kinsus Interconnect Technology: 8 patents #6 of 37Top 20%
Overall (All Time): #189,837 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12322721 Asymmetric Stackup Structure for SoC package substrates Yikang Deng, Taegui Kim, Yifan Kao 2025-06-03
11908819 Semiconductor packaging substrate fine pitch metal bump and reinforcement structures Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim 2024-02-20
11862597 Asymmetric stackup structure for SoC package substrates Yikang Deng, Taegui Kim, Yifan Kao 2024-01-02
11545455 Semiconductor packaging substrate fine pitch metal bump and reinforcement structures Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim 2023-01-03
10991659 Substrate-less integrated components Flynn Carson, Meng Chi Lee, Shatki S. Chauhan 2021-04-27
10535611 Substrate-less integrated components Flynn Carson, Meng Chi Lee, Shakti Singh Chauhan 2020-01-14
10522475 Vertical interconnects for self shielded system in package (SiP) modules Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin 2019-12-31
10115677 Vertical interconnects for self shielded system in package (SiP) modules Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin 2018-10-30
10109593 Self shielded system in package (SiP) modules Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin 2018-10-23
9899239 Carrier ultra thin substrate Flynn Carson, Kwan-Yu Lai 2018-02-20
9721903 Vertical interconnects for self shielded system in package (SiP) modules Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin 2017-08-01
9633953 Methodology to achieve zero warpage for IC package Jie Zhao 2017-04-25
9570367 Ultra fine pitch PoP coreless package Jun Zhai 2017-02-14
9351409 Method of manufacturing a thin support package structure Hsueh-Ping Chien 2016-05-24
9305853 Ultra fine pitch PoP coreless package Jun Zhai 2016-04-05
8837808 Method of final defect inspection Chia-Chi Lo, Cheng-Hsiung Yang 2014-09-16
8754328 Laminate circuit board with a multi-layer circuit structure Chi-Ming Lin, Tso-Hung Yeh, Ya-Hsiang Chen 2014-06-17
8547548 Final defect inspection system Chia-Chi Lo, Cheng-Hsiung Yang 2013-10-01
8315063 Solder pad structure with high bondability to solder ball 2012-11-20
7805835 Method for selectively processing surface tension of solder mask layer in circuit board Hsien-Ming Dai, Jen-Fang Chang 2010-10-05
7768131 Package structure preventing solder overflow on substrate solder pads Chen-Lin Li 2010-08-03
7662662 Method for manufacturing carrier substrate Bing-Kuen Lin, Chao-Lung Wang 2010-02-16