| 12322721 |
Asymmetric Stackup Structure for SoC package substrates |
Yikang Deng, Taegui Kim, Yifan Kao |
2025-06-03 |
|
| 11908819 |
Semiconductor packaging substrate fine pitch metal bump and reinforcement structures |
Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim |
2024-02-20 |
$143,830,000 |
| 11862597 |
Asymmetric stackup structure for SoC package substrates |
Yikang Deng, Taegui Kim, Yifan Kao |
2024-01-02 |
$111,466,000 |
| 11545455 |
Semiconductor packaging substrate fine pitch metal bump and reinforcement structures |
Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim |
2023-01-03 |
$247,903,000 |
| 10991659 |
Substrate-less integrated components |
Flynn Carson, Meng Chi Lee, Shatki S. Chauhan |
2021-04-27 |
$300,345,000 |
| 10535611 |
Substrate-less integrated components |
Flynn Carson, Meng Chi Lee, Shakti Singh Chauhan |
2020-01-14 |
$151,925,000 |
| 10522475 |
Vertical interconnects for self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin |
2019-12-31 |
$109,024,000 |
| 10115677 |
Vertical interconnects for self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin |
2018-10-30 |
$119,981,000 |
| 10109593 |
Self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin |
2018-10-23 |
$108,278,000 |
| 9899239 |
Carrier ultra thin substrate |
Flynn Carson, Kwan-Yu Lai |
2018-02-20 |
$98,367,000 |
| 9721903 |
Vertical interconnects for self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin |
2017-08-01 |
$97,661,000 |
| 9633953 |
Methodology to achieve zero warpage for IC package |
Jie Zhao |
2017-04-25 |
$59,408,000 |
| 9570367 |
Ultra fine pitch PoP coreless package |
Jun Zhai |
2017-02-14 |
$78,066,000 |
| 9351409 |
Method of manufacturing a thin support package structure |
Hsueh-Ping Chien |
2016-05-24 |
|
| 9305853 |
Ultra fine pitch PoP coreless package |
Jun Zhai |
2016-04-05 |
$46,684,000 |
| 8837808 |
Method of final defect inspection |
Chia-Chi Lo, Cheng-Hsiung Yang |
2014-09-16 |
|
| 8754328 |
Laminate circuit board with a multi-layer circuit structure |
Chi-Ming Lin, Tso-Hung Yeh, Ya-Hsiang Chen |
2014-06-17 |
|
| 8547548 |
Final defect inspection system |
Chia-Chi Lo, Cheng-Hsiung Yang |
2013-10-01 |
|
| 8315063 |
Solder pad structure with high bondability to solder ball |
— |
2012-11-20 |
|
| 7805835 |
Method for selectively processing surface tension of solder mask layer in circuit board |
Hsien-Ming Dai, Jen-Fang Chang |
2010-10-05 |
|
| 7768131 |
Package structure preventing solder overflow on substrate solder pads |
Chen-Lin Li |
2010-08-03 |
|
| 7662662 |
Method for manufacturing carrier substrate |
Bing-Kuen Lin, Chao-Lung Wang |
2010-02-16 |
|
