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Asymmetric Stackup Structure for SoC package substrates |
Yikang Deng, Taegui Kim, Yifan Kao |
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Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim |
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Asymmetric stackup structure for SoC package substrates |
Yikang Deng, Taegui Kim, Yifan Kao |
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Semiconductor packaging substrate fine pitch metal bump and reinforcement structures |
Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim |
2023-01-03 |
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Substrate-less integrated components |
Flynn Carson, Meng Chi Lee, Shatki S. Chauhan |
2021-04-27 |
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Substrate-less integrated components |
Flynn Carson, Meng Chi Lee, Shakti Singh Chauhan |
2020-01-14 |
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Vertical interconnects for self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin |
2019-12-31 |
| 10115677 |
Vertical interconnects for self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin |
2018-10-30 |
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Self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin |
2018-10-23 |
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Carrier ultra thin substrate |
Flynn Carson, Kwan-Yu Lai |
2018-02-20 |
| 9721903 |
Vertical interconnects for self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin |
2017-08-01 |
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Methodology to achieve zero warpage for IC package |
Jie Zhao |
2017-04-25 |
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Ultra fine pitch PoP coreless package |
Jun Zhai |
2017-02-14 |
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Method of manufacturing a thin support package structure |
Hsueh-Ping Chien |
2016-05-24 |
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Ultra fine pitch PoP coreless package |
Jun Zhai |
2016-04-05 |
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Method of final defect inspection |
Chia-Chi Lo, Cheng-Hsiung Yang |
2014-09-16 |
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Laminate circuit board with a multi-layer circuit structure |
Chi-Ming Lin, Tso-Hung Yeh, Ya-Hsiang Chen |
2014-06-17 |
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Final defect inspection system |
Chia-Chi Lo, Cheng-Hsiung Yang |
2013-10-01 |
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Solder pad structure with high bondability to solder ball |
— |
2012-11-20 |
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Method for selectively processing surface tension of solder mask layer in circuit board |
Hsien-Ming Dai, Jen-Fang Chang |
2010-10-05 |
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Package structure preventing solder overflow on substrate solder pads |
Chen-Lin Li |
2010-08-03 |
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Method for manufacturing carrier substrate |
Bing-Kuen Lin, Chao-Lung Wang |
2010-02-16 |