Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12287680 | Computing device case | Supratik Datta, Karan S. Jain, Ehsan Khajeh, Arash Akhavan Fomani, Daniel P. Kumar +12 more | 2025-04-29 |
| 12041728 | Selective soldering with photonic soldering technology | Maryam Rahimi, Wyeman Chen, Leilei Zhang, Jason P. Marsh, Lan H. Hoang +1 more | 2024-07-16 |
| 12035466 | Systems and methods for manufacturing thin substrate | Mark J. Beesley, Nima Shahidi, Hao Shi, Quan Qi | 2024-07-09 |
| 11539086 | Methods for determining and controlling battery expansion | Daniel W. Jarvis, David M. DeMuro, Hongli Dai, Julian Malinski, Julien Marcil +6 more | 2022-12-27 |
| 11164694 | Low-spurious electric-field inductor design | Daniel P. Kumar, Frank Y. Yuan, Xinbo He, Rajarshi Paul | 2021-11-02 |
| 10991659 | Substrate-less integrated components | Flynn Carson, Jun Chung Hsu, Shatki S. Chauhan | 2021-04-27 |
| 10966321 | System-in-package including opposing circuit boards | Yanfeng Chen, Shankar S. Pennathur, Mandar Painaik, Lan H. Hoang | 2021-03-30 |
| 10847846 | Methods for determining and controlling battery expansion | Daniel W. Jarvis, David M. DeMuro, Hongli Dai, Julian Malinski, Julien Marcil +6 more | 2020-11-24 |
| 10709018 | System-in-package including opposing circuit boards | Yanfeng Chen, Shankar S. Pennathur, Mandar Painaik, Lan H. Hoang | 2020-07-07 |
| 10631410 | Stacked printed circuit board packages | Corey S. Provencher, Derek Walters, Ian A. Spraggs, Flynn Carson, Shakti Singh Chauhan +9 more | 2020-04-21 |
| 10624214 | Low-profile space-efficient shielding for SIP module | Amir Salehi, Takayoshi Katahira, Vu T. Vo, Wyeman Chen, Chang Liu +4 more | 2020-04-14 |
| 10535611 | Substrate-less integrated components | Flynn Carson, Jun Chung Hsu, Shakti Singh Chauhan | 2020-01-14 |
| 10522475 | Vertical interconnects for self shielded system in package (SiP) modules | Shakti Singh Chauhan, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2019-12-31 |
| 10455707 | Connection pad for embedded components in PCB packaging | Kenneth Leland Kiplinger, Mark J. Beesley, Shawn X. Arnold, Shyam Harindralal Ratnayake | 2019-10-22 |
| 10356903 | System-in-package including opposing circuit boards | Yanfeng Chen, Shankar S. Pennathur, Mandar Painaik, Lan H. Hoang | 2019-07-16 |
| 10296058 | EMI shielding for disconnected contacts | Ayewin Oung, Eric S. Jol | 2019-05-21 |
| 10147685 | System-in-package devices with magnetic shielding | Phillip R. Sommer, Shankar S. Pennathur, Shakti Singh Chauhan, Yanfeng Chen | 2018-12-04 |
| 10115677 | Vertical interconnects for self shielded system in package (SiP) modules | Shakti Singh Chauhan, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2018-10-30 |
| 10109593 | Self shielded system in package (SiP) modules | Shakti Singh Chauhan, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2018-10-23 |
| 9917335 | Methods for determining and controlling battery expansion | Daniel W. Jarvis, David M. DeMuro, Hongli Dai, Julian Malinski, Julien Marcil +6 more | 2018-03-13 |
| 9839133 | Low-area overhead connectivity solutions to SIP module | Shankar S. Pennathur, Scott L. Gooch, Dennis R. Pyper, Amir Salehi | 2017-12-05 |
| 9721903 | Vertical interconnects for self shielded system in package (SiP) modules | Shakti Singh Chauhan, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2017-08-01 |
| 9262992 | Multiple hardware paths for backlight control in computer systems | Adrian E. Sun, Craig Prouse, Maciej Maciesowicz, Siji Menokki Kandiyil | 2016-02-16 |