Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107283 | Cell packaging techniques | Angelo V. Marasco, Nathan J. Bohney, John M. McCambridge, Antonio Manenti, Laura Mayer +2 more | 2024-10-01 |
| 10149396 | Circuit assembly for an electronic device | Jason Lor, Siddharth Nangia | 2018-12-04 |
| 9839133 | Low-area overhead connectivity solutions to SIP module | Meng Chi Lee, Shankar S. Pennathur, Dennis R. Pyper, Amir Salehi | 2017-12-05 |
| 9484228 | Simultaneous independently controlled dual side PCB molding technique | Shankar S. Pennathur | 2016-11-01 |
| 6812068 | Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages | Joseph Brand | 2004-11-02 |
| 6444497 | Method and apparatus for reducing BGA warpage caused by encapsulation | Richard W. Wensel | 2002-09-03 |
| 6399425 | Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices | Joseph Brand | 2002-06-04 |
| 6387731 | Method and apparatus for reducing BGA warpage caused by encapsulation | Richard W. Wensel | 2002-05-14 |
| 6383292 | Semiconductor device encapsulators | Joseph Brand | 2002-05-07 |
| 6291899 | Method and apparatus for reducing BGA warpage caused by encapsulation | Richard W. Wensel | 2001-09-18 |