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Flex board and flexible module |
Leilei Zhang, Lan H. Hoang |
2024-07-16 |
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Corey S. Provencher, Meng Chi Lee, Derek Walters, Ian A. Spraggs, Flynn Carson +9 more |
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Circuit substrate with embedded heat sink |
Venkataram R. Raju, Yazan Z. Alnahhas |
2019-11-05 |
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David A. Pakula, Daniel W. Jarvis, Gregory N. Stephens, Ian A. Spraggs, Vu T. Vo +5 more |
2019-10-22 |
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Circuit substrate with embedded heat sink |
Venkataram R. Raju, Yazan Z. Alnahhas |
2018-07-24 |
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Connector inserts and receptacle tongues formed using printed circuit boards |
Mahmoud R. Amini, Zheng Gao |
2018-06-05 |
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Microphone assembly having an acoustic leak path |
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2018-02-06 |
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Low-area overhead connectivity solutions to SIP module |
Meng Chi Lee, Shankar S. Pennathur, Scott L. Gooch, Amir Salehi |
2017-12-05 |
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Printed circuit board with compact groups of devices |
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2017-08-22 |
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Printed circuits with embedded strain gauges |
Anne M. Mason, Bryan McDonald, Shawn X. Arnold, Matthew P. Casebolt |
2017-03-14 |
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Liquid-based pressure sensitive adhesive for grounding applications |
James R. Krogdahl, Benjamin J. Pope, Nicholas G. L. Merz, Scott A. Myers |
2016-02-09 |
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Printed circuit board with integral radio-frequency shields |
Joseph Fisher, Sean Anthony Mayo, Paul Nangeroni, Jose Mantovani |
2015-12-29 |
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Antenna structures and shield layers on packaged wireless circuits |
Shawn X. Arnold, Jeffrey M. Thoma, Scott Mullins |
2015-11-24 |
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Electromagnetic interference shielding techniques |
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2015-10-06 |
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Multi-part substrate assemblies for low profile portable electronic devices |
Kyle Yeates, James W. Bilanski |
2014-11-04 |
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Gloria Lin, William Bryson Gardner, Jr., Joseph Fisher, Amir Salehi |
2014-10-14 |
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Devices and methods for embedding semiconductors in printed circuit boards |
Shawn X. Arnold |
2014-08-19 |
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Three dimensional passive multi-component structures |
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Shawn X. Arnold |
2014-03-04 |
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2014-02-18 |
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Systems and methods for providing vias through a modular component |
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2012-11-13 |
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Multi-part substrate assemblies for low profile portable electronic devices |
Kyle Yeates, James W. Bilanski |
2011-12-06 |