Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040262 | Flex board and flexible module | Leilei Zhang, Lan H. Hoang | 2024-07-16 |
| 10631410 | Stacked printed circuit board packages | Corey S. Provencher, Meng Chi Lee, Derek Walters, Ian A. Spraggs, Flynn Carson +9 more | 2020-04-21 |
| 10624214 | Low-profile space-efficient shielding for SIP module | Amir Salehi, Takayoshi Katahira, Vu T. Vo, Wyeman Chen, Chang Liu +4 more | 2020-04-14 |
| 10470307 | Circuit substrate with embedded heat sink | Venkataram R. Raju, Yazan Z. Alnahhas | 2019-11-05 |
| 10455738 | Stacked circuit board architecture in an electronic device | David A. Pakula, Daniel W. Jarvis, Gregory N. Stephens, Ian A. Spraggs, Vu T. Vo +5 more | 2019-10-22 |
| 10034375 | Circuit substrate with embedded heat sink | Venkataram R. Raju, Yazan Z. Alnahhas | 2018-07-24 |
| 9992863 | Connector inserts and receptacle tongues formed using printed circuit boards | Mahmoud R. Amini, Zheng Gao | 2018-06-05 |
| 9888307 | Microphone assembly having an acoustic leak path | Nikolas T. Vitt, Neal D. Evans, Jesse A. Lippert, Ruchir M. Dave, Christopher Wilk +2 more | 2018-02-06 |
| 9839133 | Low-area overhead connectivity solutions to SIP module | Meng Chi Lee, Shankar S. Pennathur, Scott L. Gooch, Amir Salehi | 2017-12-05 |
| 9743522 | Printed circuit board with compact groups of devices | Xingqun Li, Carlos Ribas, James H. Foster, Joseph Fisher, Scott Mullins +2 more | 2017-08-22 |
| 9593991 | Printed circuits with embedded strain gauges | Anne M. Mason, Bryan McDonald, Shawn X. Arnold, Matthew P. Casebolt | 2017-03-14 |
| 9258906 | Liquid-based pressure sensitive adhesive for grounding applications | James R. Krogdahl, Benjamin J. Pope, Nicholas G. L. Merz, Scott A. Myers | 2016-02-09 |
| 9226435 | Printed circuit board with integral radio-frequency shields | Joseph Fisher, Sean Anthony Mayo, Paul Nangeroni, Jose Mantovani | 2015-12-29 |
| 9196958 | Antenna structures and shield layers on packaged wireless circuits | Shawn X. Arnold, Jeffrey M. Thoma, Scott Mullins | 2015-11-24 |
| 9155188 | Electromagnetic interference shielding techniques | Nicholas G. L. Merz, Hong Feng Wang, Michael Nikkhoo, Christopher M. Werner | 2015-10-06 |
| 8942002 | Three dimensional passive multi-component structures | Shawn X. Arnold, Douglas P. Kidd, Sean Anthony Mayo, Scott Mullins, Jeffrey M. Thoma +1 more | 2015-01-27 |
| 8879272 | Multi-part substrate assemblies for low profile portable electronic devices | Kyle Yeates, James W. Bilanski | 2014-11-04 |
| 8861217 | Systems and methods for providing vias through a modular component | Gloria Lin, William Bryson Gardner, Jr., Joseph Fisher, Amir Salehi | 2014-10-14 |
| 8809859 | Devices and methods for embedding semiconductors in printed circuit boards | Shawn X. Arnold | 2014-08-19 |
| 8767408 | Three dimensional passive multi-component structures | Shawn X. Arnold, Douglas P. Kidd, Sean Anthony Mayo, Scott Mullins, Jeffrey M. Thoma +1 more | 2014-07-01 |
| 8664656 | Devices and methods for embedding semiconductors in printed circuit boards | Shawn X. Arnold | 2014-03-04 |
| 8654537 | Printed circuit board with integral radio-frequency shields | Joseph Fisher, Sean Anthony Mayo, Paul Nangeroni, Jose Mantovani | 2014-02-18 |
| 8334704 | Systems and methods for providing a system-on-a-substrate | Gloria Lin, Bryson Gardner, Joseph Fisher, Dave Goh, Barry Corlett +1 more | 2012-12-18 |
| 8310835 | Systems and methods for providing vias through a modular component | Gloria Lin, Bryson Gardner, Joseph Fisher, Amir Salehi | 2012-11-13 |
| 8072764 | Multi-part substrate assemblies for low profile portable electronic devices | Kyle Yeates, James W. Bilanski | 2011-12-06 |