Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11266010 | Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices | Yanfeng Chen | 2022-03-01 |
| 10966321 | System-in-package including opposing circuit boards | Yanfeng Chen, Mandar Painaik, Lan H. Hoang, Meng Chi Lee | 2021-03-30 |
| 10709018 | System-in-package including opposing circuit boards | Yanfeng Chen, Mandar Painaik, Lan H. Hoang, Meng Chi Lee | 2020-07-07 |
| 10356903 | System-in-package including opposing circuit boards | Yanfeng Chen, Mandar Painaik, Lan H. Hoang, Meng Chi Lee | 2019-07-16 |
| 10147685 | System-in-package devices with magnetic shielding | Phillip R. Sommer, Meng Chi Lee, Shakti Singh Chauhan, Yanfeng Chen | 2018-12-04 |
| 9949359 | Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices | Yanfeng Chen | 2018-04-17 |
| 9913412 | Shielding structures for system-in-package assemblies in portable electronic devices | Yanfeng Chen | 2018-03-06 |
| 9839133 | Low-area overhead connectivity solutions to SIP module | Meng Chi Lee, Scott L. Gooch, Dennis R. Pyper, Amir Salehi | 2017-12-05 |
| 9820373 | Thermal solutions for system-in-package assemblies in portable electronic devices | Carlos Ribas, Deniz Teoman, Michael Eng | 2017-11-14 |
| 9618564 | Printed circuits with sacrificial test structures | Sean Anthony Mayo | 2017-04-11 |
| 9484228 | Simultaneous independently controlled dual side PCB molding technique | Scott L. Gooch | 2016-11-01 |
| 9485870 | Methods for transparent encapsulation and selective encapsulation | Sean Anthony Mayo, James H. Foster, Trevor J. Ness | 2016-11-01 |