Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12153268 | Technologies for increased volumetric and functional efficiencies of optical packages | Scott D. Morrison, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida | 2024-11-26 |
| 12148741 | Sidewall connections and button interconnects for molded SiPs | Bilal Mohamed Ibrahim Kani, Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida +2 more | 2024-11-19 |
| 12095185 | Built-in connector for board-to-board and flex-to-rigid board connection | Takayoshi Katahira, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Manoj Vadeentavida, Jing Tao | 2024-09-17 |
| 12040262 | Flex board and flexible module | Dennis R. Pyper, Leilei Zhang | 2024-07-16 |
| 12041728 | Selective soldering with photonic soldering technology | Maryam Rahimi, Meng Chi Lee, Wyeman Chen, Leilei Zhang, Jason P. Marsh +1 more | 2024-07-16 |
| 11765838 | Right angle sidewall and button interconnects for molded SiPs | Bilal Mohamed Ibrahim Kani, Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida +2 more | 2023-09-19 |
| 11462461 | System in package for lower z height and reworkable component assembly | Leilei Zhang | 2022-10-04 |
| 11388817 | Electrical components attached to fabric | Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian +7 more | 2022-07-12 |
| 10966321 | System-in-package including opposing circuit boards | Yanfeng Chen, Shankar S. Pennathur, Mandar Painaik, Meng Chi Lee | 2021-03-30 |
| 10959331 | Electrical components attached to fabric | Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian +7 more | 2021-03-23 |
| 10709018 | System-in-package including opposing circuit boards | Yanfeng Chen, Shankar S. Pennathur, Mandar Painaik, Meng Chi Lee | 2020-07-07 |
| 10701802 | Electrical components attached to fabric | Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian +7 more | 2020-06-30 |
| 10638608 | Interconnect frames for SIP modules | Raghunandan Chaware, Chang Liu, Takayoshi Katahira | 2020-04-28 |
| 10624214 | Low-profile space-efficient shielding for SIP module | Amir Salehi, Takayoshi Katahira, Vu T. Vo, Wyeman Chen, Chang Liu +4 more | 2020-04-14 |
| 10602612 | Vertical module and perpendicular pin array interconnect for stacked circuit board structure | Takayoshi Katahira, Leilei Zhang, Raghunandan Chaware | 2020-03-24 |
| 10485103 | Electrical components attached to fabric | Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian +7 more | 2019-11-19 |
| 10356903 | System-in-package including opposing circuit boards | Yanfeng Chen, Shankar S. Pennathur, Mandar Painaik, Meng Chi Lee | 2019-07-16 |
| 10334732 | Area-efficient connections to SIP modules | Takayoshi Katahira | 2019-06-25 |
| 10292258 | Vertical shielding and interconnect for SIP modules | Takayoshi Katahira | 2019-05-14 |
| 9721921 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Pandi C. Marimuthu +3 more | 2017-08-01 |
| 9287204 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Pandi C. Marimuthu +3 more | 2016-03-15 |
| 9245770 | Semiconductor device and method of simultaneous molding and thermalcompression bonding | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Pandi C. Marimuthu +2 more | 2016-01-26 |
| 9240331 | Semiconductor device and method of making bumpless flipchip interconnect structures | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Pandi C. Marimuthu +3 more | 2016-01-19 |
| 8442706 | Module for integrated approach to an offshore facility | Ronald S. Doeppner, Donald W. Fowler, Stephen P. Lee, Anil Mehra | 2013-05-14 |
| 7906857 | Molded integrated circuit package and method of forming a molded integrated circuit package | Raghunandan Chaware, Laurene Yip | 2011-03-15 |