Issued Patents All Time
Showing 25 most recent of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094729 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon | 2024-09-17 |
| 12094843 | Antenna in embedded wafer-level ball-grid array package | Andy Chang Bum Yong, Aung Kyaw Oo, Yaojian Lin | 2024-09-17 |
| 11961764 | Semiconductor device and method of making a wafer-level chip-scale package | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2024-04-16 |
| 11488932 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Il Kwon Shim, Yaojian Lin | 2022-11-01 |
| 11488933 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Il Kwon Shim, Byung Joon Han | 2022-11-01 |
| 11469191 | Antenna in embedded wafer-level ball-grid array package | Andy Chang Bum Yong, Aung Kyaw Oo, Yaojian Lin | 2022-10-11 |
| 11222793 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon | 2022-01-11 |
| 11127668 | Semiconductor device and method of forming double-sided fan-out wafer level package | Il Kwon Shim, Won Kyoung Choi, Sze Ping Goh, Jose Alvin Caparas | 2021-09-21 |
| 11024561 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Yaojian Lin, Kang Chen, Yu Gu | 2021-06-01 |
| 11011423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2021-05-18 |
| 10777528 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Il Kwon Shim, Byung Joon Han | 2020-09-15 |
| 10707150 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Yaojian Lin, Kang Chen, Yu Gu | 2020-07-07 |
| 10658330 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Il Kwon Shim, Yaojian Lin | 2020-05-19 |
| 10636753 | Antenna in embedded wafer-level ball-grid array package | Andy Chang Bum Yong, Aung Kyaw Oo, Yaojian Lin | 2020-04-28 |
| 10622293 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Kang Chen, Xusheng Bao +1 more | 2020-04-14 |
| 10515828 | Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon | 2019-12-24 |
| 10510632 | Method of packaging thin die and semiconductor device including thin die | Won Kyoung Choi | 2019-12-17 |
| 10453785 | Semiconductor device and method of forming double-sided fan-out wafer level package | Il Kwon Shim, Won Kyoung Choi, Sze Ping Goh, Jose Alvin Caparas | 2019-10-22 |
| 10446523 | Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP | Sheila Marie L. Alvarez, Yaojian Lin, Jose Alvin Caparas, Yang Tan | 2019-10-15 |
| 10446479 | Semiconductor device and method of forming a PoP device with embedded vertical interconnect units | Yaojian Lin, Kang Chen, Yu Gu, Won Kyoung Choi | 2019-10-15 |
| 10388612 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Won Kyoung Choi +1 more | 2019-08-20 |
| 10242948 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Jun Mo Koo, Yaojian Lin, See Chian Lim | 2019-03-26 |
| 10181423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2019-01-15 |
| 10141222 | Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP | Yaojian Lin | 2018-11-27 |
| 10115701 | Semiconductor device and method of forming conductive vias by backside via reveal with CMP | Xing Zhao, Duk Ju Na, Siew Joo Tan | 2018-10-30 |