Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10622293 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen +1 more | 2020-04-14 |
| 9478485 | Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP | KwokKeung Szeto | 2016-10-25 |
| 9437552 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Jianmin Fang, Xia Feng | 2016-09-06 |
| 9401331 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Kang Chen, Jianmin Fang | 2016-07-26 |
| 9397058 | Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration | Ma Phoo Pwint Hlaing, Jian Zuo | 2016-07-19 |
| 9293401 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen +1 more | 2016-03-22 |
| 9252172 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Lee Sun Lim, Rui Huang, Ma Phoo Pwint Hlaing | 2016-02-02 |
| 9236278 | Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof | Rui Huang, Kang Chen, Yung Kuan Hsiao, Hin Hwa Goh | 2016-01-12 |
| 9171769 | Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package | Seng Guan Chow, Lee Sun Lim, Rui Huang, Ma Phoo Pwint Hlaing | 2015-10-27 |
| 9142522 | Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump | Ma Phoo Pwint Hlaing, Jian Zuo | 2015-09-22 |
| 8963326 | Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration | Ma Phoo Pwint Hlaing, Jian Zuo | 2015-02-24 |
| 8878359 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Jianmin Fang, Xia Feng | 2014-11-04 |
| 8796846 | Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Kang Chen, Jianmin Fang | 2014-08-05 |
| 8766426 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Hin Hwa Goh, Yung Kuan Hsiao, Kang Chen, Rui Huang | 2014-07-01 |
| 8455991 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Yung Kuan Hsiao, Kang Chen, Hin Hwa Goh, Rui Huang | 2013-06-04 |
| 8421212 | Integrated circuit packaging system with active surface heat removal and method of manufacture thereof | Kang Chen, Rui Huang, Yung Kuan Hsiao, Hin Hwa Goh | 2013-04-16 |
| 8409926 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Jianmin Fang, Xia Feng | 2013-04-02 |
| 8129845 | Semiconductor device and method of forming interconnect structure in non-active area of wafer | TaeHoan Jang, JaeHun Ku | 2012-03-06 |
| 7989356 | Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability | Yaojian Lin, Tae Hoan Jang | 2011-08-02 |
| 7642128 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Kang Chen, Jianmin Fang | 2010-01-05 |