XB

Xusheng Bao

SC Stats Chippac: 19 patents #58 of 425Top 15%
JC Jcet Semiconductor (Shaoxing) Co.: 1 patents #18 of 38Top 50%
Overall (All Time): #221,809 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10622293 Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen +1 more 2020-04-14
9478485 Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP KwokKeung Szeto 2016-10-25
9437552 Semiconductor device and method of forming insulating layer around semiconductor die Yaojian Lin, Kang Chen, Jianmin Fang, Xia Feng 2016-09-06
9401331 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Yaojian Lin, Kang Chen, Jianmin Fang 2016-07-26
9397058 Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration Ma Phoo Pwint Hlaing, Jian Zuo 2016-07-19
9293401 Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen +1 more 2016-03-22
9252172 Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region Seng Guan Chow, Lee Sun Lim, Rui Huang, Ma Phoo Pwint Hlaing 2016-02-02
9236278 Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof Rui Huang, Kang Chen, Yung Kuan Hsiao, Hin Hwa Goh 2016-01-12
9171769 Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package Seng Guan Chow, Lee Sun Lim, Rui Huang, Ma Phoo Pwint Hlaing 2015-10-27
9142522 Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump Ma Phoo Pwint Hlaing, Jian Zuo 2015-09-22
8963326 Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration Ma Phoo Pwint Hlaing, Jian Zuo 2015-02-24
8878359 Semiconductor device and method of forming insulating layer around semiconductor die Yaojian Lin, Kang Chen, Jianmin Fang, Xia Feng 2014-11-04
8796846 Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP Yaojian Lin, Kang Chen, Jianmin Fang 2014-08-05
8766426 Integrated circuit packaging system with warpage control and method of manufacture thereof Hin Hwa Goh, Yung Kuan Hsiao, Kang Chen, Rui Huang 2014-07-01
8455991 Integrated circuit packaging system with warpage control and method of manufacture thereof Yung Kuan Hsiao, Kang Chen, Hin Hwa Goh, Rui Huang 2013-06-04
8421212 Integrated circuit packaging system with active surface heat removal and method of manufacture thereof Kang Chen, Rui Huang, Yung Kuan Hsiao, Hin Hwa Goh 2013-04-16
8409926 Semiconductor device and method of forming insulating layer around semiconductor die Yaojian Lin, Kang Chen, Jianmin Fang, Xia Feng 2013-04-02
8129845 Semiconductor device and method of forming interconnect structure in non-active area of wafer TaeHoan Jang, JaeHun Ku 2012-03-06
7989356 Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability Yaojian Lin, Tae Hoan Jang 2011-08-02
7642128 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Yaojian Lin, Kang Chen, Jianmin Fang 2010-01-05