Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620557 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Rui Huang, Xu Sheng Bao, Ma Phoo Pwint Hlaing | 2017-04-11 |
| 9252172 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Rui Huang, Xusheng Bao, Ma Phoo Pwint Hlaing | 2016-02-02 |
| 9171769 | Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package | Seng Guan Chow, Rui Huang, Xusheng Bao, Ma Phoo Pwint Hlaing | 2015-10-27 |
| 8110913 | Integrated circuit package system with integral inner lead and paddle | Byung Tai Do, Linda Pei Ee Chua, Zheng Zheng | 2012-02-07 |