Issued Patents All Time
Showing 25 most recent of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354934 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2019-07-16 |
| 10170385 | Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP | Yaojian Lin, Kang Chen, Yu Gu | 2019-01-01 |
| 9978658 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2018-05-22 |
| 9960130 | Reliable interconnect | Chun Hong Wo, Antonio Jr. Bambalan Dimaano | 2018-05-01 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2017-05-30 |
| 9620557 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Lee Sun Lim, Xu Sheng Bao, Ma Phoo Pwint Hlaing | 2017-04-11 |
| 9564387 | Semiconductor package having routing traces therein | Saravuth Sirinorakul, Antonio B. Dimaano, Jr. | 2017-02-07 |
| 9524955 | Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2016-12-20 |
| 9515016 | Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan | 2016-12-06 |
| 9508623 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2016-11-29 |
| 9385009 | Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP | Yaojian Lin, Kang Cheng, Gu Yu | 2016-07-05 |
| 9293350 | Semiconductor package system with cavity substrate and manufacturing method therefor | Seng Guan Chow, Heap Hoe Kuan | 2016-03-22 |
| 9275877 | Semiconductor device and method of forming semiconductor package using panel form carrier | Yaojian Lin, Heap Hoe Kuan, Seng Guan Chow | 2016-03-01 |
| 9257356 | Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2016-02-09 |
| 9252172 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Lee Sun Lim, Xusheng Bao, Ma Phoo Pwint Hlaing | 2016-02-02 |
| 9236278 | Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof | Xusheng Bao, Kang Chen, Yung Kuan Hsiao, Hin Hwa Goh | 2016-01-12 |
| 9171769 | Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package | Seng Guan Chow, Lee Sun Lim, Xusheng Bao, Ma Phoo Pwint Hlaing | 2015-10-27 |
| 9162222 | Method for tuning surface structure of metallic nano-catalyst and preparation method thereof | Shi Sun, Sheng-pei Chen | 2015-10-20 |
| 9123733 | Integrated circuit packaging system with package underfill and method of manufacture thereof | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2015-09-01 |
| 9099455 | Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant | Seng Guan Chow, Il Kwon Shim, Heap Hoe Kuan | 2015-08-04 |
| 9087930 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2015-07-21 |
| 8963309 | Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua | 2015-02-24 |
| 8803330 | Integrated circuit package system with mounting structure | Seng Guan Chow, Heap Hoe Kuan | 2014-08-12 |
| 8790962 | Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure | Reza A. Pagaila, Yaojian Lin | 2014-07-29 |
| 8766426 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Hin Hwa Goh, Xusheng Bao, Yung Kuan Hsiao, Kang Chen | 2014-07-01 |