Issued Patents All Time
Showing 1–25 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901308 | Semiconductor packages with integrated shielding | Il Kwon Shim, Kok Chuen Lock, Roel Adeva Robles, Eakkasit Dumsong | 2024-02-13 |
| 11804416 | Semiconductor device and method of forming protective layer around cavity of semiconductor die | Preecha Joymak, Natawat Kasikornrungroj, Wasu Aingkaew, Kawin Saiubol, Thanawat Jaengkrajarng | 2023-10-31 |
| 11227818 | Stacked dies electrically connected to a package substrate by lead terminals | Wing Keung Lam, Kok Chuen Lock, Roel Adeva Robles | 2022-01-18 |
| 11139233 | Cavity wall structure for semiconductor packaging | Hua Tan, Wilson Poh Leng Ong, Kriangsak Sae Le, Somsak Phukronghin, Paweena Phatto | 2021-10-05 |
| 10734247 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2020-08-04 |
| 10707161 | Cavity wall structure for semiconductor packaging | Hua Tan, Wilson Poh Leng Ong, Kriangsak Sae Le, Somsak Phukronghin, Paweena Phatto | 2020-07-07 |
| 10658277 | Semiconductor package with a heat spreader and method of manufacturing thereof | Antonio B. Dimaano, Jr., Nataporn Charusabha, Preecha Joymak, Roel Adeva Robles | 2020-05-19 |
| 10600741 | Semiconductor package with plated metal shielding and a method thereof | Suebphong Yenrudee, Chanapat Kongpoung, Sant Hongsongkiat, Siriwanna Ounkaew, Chatchawan Injan | 2020-03-24 |
| 10586771 | Conductive shield for semiconductor package | Somchai Nondhasitthichail | 2020-03-10 |
| 10515878 | Semiconductor package with partial plating on contact side surfaces | Somchai Nondhasitthichai, Woraya Benjasukul | 2019-12-24 |
| 10361146 | Semiconductor package with multiple stacked leadframes and a method of manufacturing the same | Keith M. Edwards, Suebphong Yenrudee, Albert Loh | 2019-07-23 |
| 10325782 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2019-06-18 |
| 10276477 | Semiconductor package with multiple stacked leadframes and a method of manufacturing the same | Keith M. Edwards, Suebphong Yenrudee, Albert Loh | 2019-04-30 |
| 10269686 | Method of improving adhesion between molding compounds and an apparatus thereof | Suebphong Yenrudee | 2019-04-23 |
| 10242953 | Semiconductor package with plated metal shielding and a method thereof | Suebphong Yenrudee, Chanapat Kongpoung, Sant Hongsongkiat, Siriwanna Ounkaew, Chatchawan Injan | 2019-03-26 |
| 10242934 | Semiconductor package with full plating on contact side surfaces and methods thereof | — | 2019-03-26 |
| 10204850 | Semiconductor package with partial plating on contact side surfaces | Somchai Nondhasitthichai, Woraya Benjavasukul | 2019-02-12 |
| 10163658 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2018-12-25 |
| 10096490 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2018-10-09 |
| 10032645 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2018-07-24 |
| 9972563 | Plated terminals with routing interconnections semiconductor device | — | 2018-05-15 |
| 9947605 | Flip chip cavity package | Somchai Nondhasitthichai | 2018-04-17 |
| 9922914 | Plated terminals with routing interconnections semiconductor device | — | 2018-03-20 |
| 9922913 | Plated terminals with routing interconnections semiconductor device | — | 2018-03-20 |
| 9922843 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2018-03-20 |