Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293972 | Semiconductor device and method of forming leadframe with clip bond for electrical interconnect | Phongsak Sawasdee, Wannasat Panphrom | 2025-05-06 |
| 11804416 | Semiconductor device and method of forming protective layer around cavity of semiconductor die | Saravuth Sirinorakul, Preecha Joymak, Wasu Aingkaew, Kawin Saiubol, Thanawat Jaengkrajarng | 2023-10-31 |