Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293972 | Semiconductor device and method of forming leadframe with clip bond for electrical interconnect | Natawat Kasikornrungroj, Wannasat Panphrom | 2025-05-06 |
| 12230615 | Semiconductor packages with vertical passive components | Jiraphat Charoenratpratoom, Wannasat Panphrom | 2025-02-18 |
| 11784102 | Hermetic semiconductor packages | Eakkasit Dumsong, Mike Jayson Candelario, Jiraphat Charoenratpratoom, Paweena Phatto, Maythichai Saithong | 2023-10-10 |