Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901308 | Semiconductor packages with integrated shielding | Saravuth Sirinorakul, Il Kwon Shim, Roel Adeva Robles, Eakkasit Dumsong | 2024-02-13 |
| 11227818 | Stacked dies electrically connected to a package substrate by lead terminals | Wing Keung Lam, Saravuth Sirinorakul, Roel Adeva Robles | 2022-01-18 |