Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901308 | Semiconductor packages with integrated shielding | Saravuth Sirinorakul, Il Kwon Shim, Kok Chuen Lock, Eakkasit Dumsong | 2024-02-13 |
| 11227818 | Stacked dies electrically connected to a package substrate by lead terminals | Wing Keung Lam, Saravuth Sirinorakul, Kok Chuen Lock | 2022-01-18 |
| 10714431 | Semiconductor packages with electromagnetic interference shielding | Antonio B. Dimaano, Jr., Dzafir Bin Mohd Shariff, Seung Guen Park | 2020-07-14 |
| 10658277 | Semiconductor package with a heat spreader and method of manufacturing thereof | Antonio B. Dimaano, Jr., Nataporn Charusabha, Saravuth Sirinorakul, Preecha Joymak | 2020-05-19 |
| 10573590 | Multi-layer leadless semiconductor package and method of manufacturing the same | Antonio B. Dimaano, Jr. | 2020-02-25 |
| 10354934 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le +3 more | 2019-07-16 |
| 9978658 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le +3 more | 2018-05-22 |
| 9508623 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le +3 more | 2016-11-29 |
| 8030768 | Semiconductor package with under bump metallization aligned with open vias | Danny Retuta, Mary Annie Cheong, Hien Boon Tan, Anthony Yi Sheng Sun, Richard Te Gan | 2011-10-04 |